- Micron Technology, Inc. (Boise, ID)
- …for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, ... advanced packaging team responsible for next generation high bandwidth memory ( HBM ) pathfinding and development. You will be responsible for developing CMP… more
- Micron Technology, Inc. (Boise, ID)
- …(C-mode scanning acoustic microscope), PYE ( Product Yield Enhancement), Product Engineering, Package Reliability, and AQL (Acceptable Quality Level) + ... the electrical characterization and electrical failure analysis (EFA) of all assigned product types: Compute/Mobile/Graphics DRAM, HBM , and others. You will use… more