- Microsoft Corporation (Hillsboro, OR)
- …**E** **ngineer** to work in the dynamic Microsoft Silicon Manufacturing Packaging Engineering team (SMPE). Microsoft's mission is to empower every person ... beyond. **Responsibilities** The SMPE Silicon Team is seeking a computer/electrical engineer to deliver premium-quality designs once considered impossible. We are… more
- Parker Hannifin Corporation (Milwaukie, OR)
- Mechanical Engineer II - Parker Aerospace Location : MILWAUKIE, OR, United States Job Family : Engineering Job Type : Regular Posted : Jun 19, 2024 Job ID : 49867 ... Power Conversion, Magnetics, and Sensors for extreme environment applications. The Mechanical Engineer will be a Subject Matter Expert (SME) for mechanical … more
- Avispa Technology (Hillsboro, OR)
- Manufacturing Execution Systems Engineer ROCGJP00026368 A leading biotechnology company is seeking a Manufacturing Execution Systems Recipe Engineer . The ... facility (Component Prep & Compounding, Liquid/Lyophilized Filling, automated/Manual Inspection, Packaging /Finished Products and Distribution). The ideal candidate has 5-7+… more
- Siemens Digital Industries Software (Wilsonville, OR)
- …division seeks a highly motivated, creative, and energetic individual as Product Engineer . Tessent is the market and technology leader of automated tools for ... insertion of semiconductor design-for- test (DFT) structures, automatic test pattern generation...Windows environments. + Exposure to Cloud usage, deployment and packaging A collection of over 377,000 minds building the… more
- Microsoft Corporation (Hillsboro, OR)
- …Chip (SoC) integration. + Supervise and optimize layout in latest silicon and packaging technologies. + Develop characterization and test plans and support ... and optimize the Cloud infrastructure. We are looking for a **Principal Electrical Engineer ** to join the team! **_Microsoft's mission is to empower every person and… more
- Siemens Digital Industries Software (Wilsonville, OR)
- …motivated, and high performing individual for an opportunity to serve as a Design for Test (DFT) design lead in our 3D IC Solutions Engineering team in driving the ... muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs. The… more
- Siemens Digital Industries Software (Wilsonville, OR)
- …Virtuoso) o Physical Verification: DRC, LVS, IR/EM analysis o DFT integration and ATE test support. + Working knowledge of Advanced Packaging IC EDA tools and ... muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs. The… more
- Siemens Digital Industries Software (Wilsonville, OR)
- …muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs. The ... for true 3D stacked die designs. Reference designs and test structures and/or customer designs will be used in...Additional understanding of general Physical IC design and/or IC packaging tools and concepts is favorable, including: o Place… more
- MKS Instruments Inc (Beaverton, OR)
- …product development environment. We are looking for a Principal Software Engineer within ESI's Platform Architecture group. You will enable prototype development ... ME, EE) or Physics + 8 years of experience in software design and test , for mechanical system control applications + Software architecture and development skills in… more
- MKS Instruments Inc (Beaverton, OR)
- We are looking for an exceptional Principal Electronic Engineer to join a multi-disciplinary team of engineers focused on developing innovative technology for our ... performance, reliability, and product cost + Help define and implement appropriate test plans and procedures + Analyze equipment to establish operating criteria by… more
- Siemens Digital Industries Software (Wilsonville, OR)
- …muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs. The ... the 3D IC Physical Design workflow. Reference designs and test structures and/or customer designs will be used in...Working knowledge (3-5 years of experience preferred) of Advanced Packaging IC EDA tools and design methods including: o… more
- Siemens Digital Industries Software (Wilsonville, OR)
- …muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs. The ... Timing Analysis & Signal Integrity Analysis. Reference designs and test structures and/or customer designs will be used in... support a plus + Working knowledge of Advanced Packaging EDA tools and design methods including: o 2.5D… more
- Siemens Digital Industries Software (Wilsonville, OR)
- …muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs. The ... teams to drive the requirements for these extractions. Reference designs and test structures and/or customer designs will be used in the development, testing… more
- Church & Dwight Co., Inc. (Vancouver, WA)
- …etc. + Under the direction of the Sr. Instrumentation and Controls Engineer , continually improve packaging and processing equipment controls logic for ... and process sensors of all types . Capability to calibrate and test instrumentation and controls, verify instrumentation accuracy and effectiveness and perform… more