- Micron Technology, Inc. (Boise, ID)
- …team that is molding the future of technology! **Position Overview:** As a Package Materials Integrator in Advanced Packaging Technology Development (APTD), ... global quality, and purchasing. You will be responsible for setting the advanced packaging materials roadmap, driving materials suppliers to meet roadmap… more
- Micron Technology, Inc. (Boise, ID)
- …Physics, Materials , or a closely related field + Deep knowledge of Advanced Package Integration and DRAM, NAND or other memory. (3DIC, FO, Hybrid bond etc.) ... the future of technology! **Position Overview:** As an Advanced Package TD Process Integration Engineer at Micron,...ensure rapid yield ramps of new technology nodes and packaging solutions. Expectations are to work independently and set… more
Locations:
Idaho