- Lockheed Martin (Grand Prairie, TX)
- **Description:** Lockheed Martin MFC is seeking an Advanced Packaging Engineer intern for a position in Grand Prairie, TX in support of 2D \- 3D Heterogenous ... packaging concepts of advanced electronics\. Responsibilities include, but are...semiconductor manufacturing processes, and advanced thermal management techniques\. The intern will have opportunity to apply current graduate level… more
- IGT (Reno, NV)
- …of electromechanical and peripheral devices + Must be familiar with some electro - mechanical components and related documentation, device and component design and ... Electrical Engineer Intern Location: Reno, NV, US, 89521 Requisition ID:...redesign issues + Participate in assigned tasks comprising of mechanical engineering design projects or assigned aspects of … more