• IC Packaging Principal

    Cadence Design Systems, Inc. (San Jose, CA)
    …of the Cadence tool set in the context of multiple flows including IC Packaging , high speed design, signal integrity and electrical constraints definition. ... Design experience and industry knowledge of current IC Packaging Design and manufacturing processes is required. Knowledge of advanced IC packaging flows… more
    Cadence Design Systems, Inc. (05/23/25)
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  • Principal IC Packaging

    SpaceX (Bastrop, TX)
    Principal IC Packaging Engineer, Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is out ... make this possible, with the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is… more
    SpaceX (04/15/25)
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  • Principal IC Packaging Test…

    SpaceX (Bastrop, TX)
    Principal IC Packaging Test Engineer, Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is out ... the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING TEST ENGINEER,...veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application /interview process should reach out to… more
    SpaceX (04/15/25)
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  • Principal Manager, GTM, Product Growth…

    Rubrik (Palo Alto, CA)
    …This lead will drive the creation of monetization strategy proposals, application of new monetization models, pricing promotions, and competitive takeouts. and ... management and business operations teams to implement pricing and packaging changes within the product and the quote to...of reasonable accommodation include making a change to the application process or work procedures, providing documents in an… more
    Rubrik (04/16/25)
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  • Principal Engineer, Packaging

    SanDisk (Milpitas, CA)
    …computational and/or experimental solid mechanics, is required. In-depth knowledge of IC packaging is highly desired. **Qualifications** REQUIRED: + Ph.D. ... academic coursework or experience required in mechanical engineering of IC packaging and related areas. + Strong...applying. Based on our experience, we anticipate that the application deadline will be **08/01/2025** (3 months from posting),… more
    SanDisk (05/02/25)
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  • Principal Engineer, Packaging

    SanDisk (Milpitas, CA)
    …through academic coursework or experience required in thermal modeling and measurements of IC packaging and related areas. + A strong background in thermal ... our world moving forward. **Job Description** ESSENTIAL DUTIES AND RESPONSIBILITIES: + As a Packaging Engineer, you will work in the Packaging R&D group on… more
    SanDisk (05/23/25)
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  • Principal Engineer, Packaging - San…

    Qualcomm (Santa Clara, CA)
    …Qualcomm Technologies, Inc. **Job Area:** Engineering Group, Engineering Group > Packaging Engineering **General Summary:** Qualcomm Data Center team is developing ... power integrity. The candidate will work with package and IC designers to find ways to optimize the overall...with a disability and need an accommodation during the application /hiring process, rest assured that Qualcomm is committed to… more
    Qualcomm (05/06/25)
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  • Principal or Senior Principal RF…

    Northrop Grumman (Linthicum Heights, MD)
    …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... subsystems, and large-scale high-performance computing systems. MDA is seeking a ** Principal / Senior Principal RF Design Engineer** with demonstrated ability… more
    Northrop Grumman (05/06/25)
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  • FAST Labs - Program Engineering Manager II…

    BAE Systems (Merrimack, NH)
    …, functional test, production test, and qualification + Deep understanding of the full IC development process, including IC packaging approaches and wafer, ... partnerships and collaborate across a broad innovation ecosystem that includes DoD/ IC /OGA labs and research teams, universities, small businesses, and venture… more
    BAE Systems (05/07/25)
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  • Staff Hardware Engineer

    Qualcomm (San Diego, CA)
    …systems, circuits, components, integrated circuitry, mechanical systems, equipment and packaging , optical systems, and/or DSP systems. + Conduct simulations and ... field and 2+ years of Hardware Engineering or related work experience. ** Principal Duties and Responsibilities:** + Develops basic features and components of… more
    Qualcomm (05/08/25)
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