- The Boeing Company (El Segundo, CA)
- …future with us. Boeing Defense Space & Security has an exciting opportunity as a ** Lead Advanced Microelectronics Packaging Design Engineer** . Come join ... us as part of our Electronics Packaging team located in **El Segundo, CA** . ...#YouWillChangeTheWorld **Position Responsibilities:** + Designing and optimizing layout for advanced substrates of HDI IC substrate, Silicon, or LTCC… more
- L3Harris (Palm Bay, FL)
- …and cyber domains in the interest of national security. Job Title: Senior Specialist, Advanced Packaging Integration Job Code: 23736 Job Location: Palm Bay, FL ... This position is responsible for the development and execution of advanced packaging assembly processes including hybrid and thermocompression bonding… more
- Northrop Grumman (Annapolis Junction, MD)
- …and failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... with Polygraph Preferred Qualifications for Sr. Staff Superconducting Interconnect Systems Lead : + Advanced Degrees in Electrical, Materials, Mechanical, Systems… more
- Northrop Grumman (Linthicum Heights, MD)
- …and failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... with Polygraph **Preferred Qualifications for Sr. Staff Digital Solutions SEIT / Lead Systems Engineer:** + Advanced Degrees in Electrical Engineering, Computer… more
- Northrop Grumman (Linthicum Heights, MD)
- …and failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing nodes,… more
- RTX Corporation (Andover, MA)
- …ANSYS or CAD or HFSS software + Experience in RF systems and/or Microelectronics Packaging **Qualifications We Prefer:** + Experienced user of Additive ... (RURI). A qualified candidate will have experience in RF microelectronics modeling, packaging processes, direct write/additive manufacturing techniques,… more
- Google (Mountain View, CA)
- …system levels. + Investigate roadmap opportunities related to CMOS process technologies and advanced packaging for next generation designs. Google is proud to be ... Minimum qualifications: + Bachelor's degree in Electrical Engineering, Microelectronics , a related field, or equivalent practical experience. + 6 years of experience… more
- Northrop Grumman (Elkridge, MD)
- …Surface Mount Manufacturing team + Provide Surface Mount and Advanced Packaging Manufacturing subject matter expertise, and lead the manufacturing and ... are responsible for:** + Managing and executing to the Surface Mount and Advanced Packaging development roadmap, including the maturation of low Manufacturing… more
- Teledyne (Mountain View, CA)
- …degree preferred. + 15+ years of work experience across microelectronics packaging , microwave testing, and qualifying/transferring manufacturing microwave ... Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and… more
- Micron Technology, Inc. (Boise, ID)
- …experience in crafting and handling DRAM-based solutions. + 8-10 years expertise in advanced packaging , including 2.5D/3D packaging , with prior hands-on ... + Over 15 years of meaningful experience. + MS/PhD in Electrical Engineering, Microelectronics , Physics, or a related field, or equivalent experience. + At least 8… more
- Fujifilm (North Kingstown, RI)
- …and more. We're a global business-to-business supplier of chemical formulations and advanced materials used for manufacturing and packaging semiconductors. Our ... fuels innovation in the semiconductor industry-where chemistry meets technology. Our advanced materials and formulations enable manufacturers to build the microchips… more
- Stanford University (Stanford, CA)
- …of engineering principles, techniques and systems. Stanford University and UC Berkeley co- lead the Pacific Northwest AI Hardware Hub ("NW-AI Hub"), one of eight ... hubs in the CHIPS Act-funded, Microelectronics Commons. The administrative center of the NW-AI Hub...commercial foundry devices ( **C** MOS) with emerging and advanced technologies ( **X** ), by establishing design and… more
- Globus Medical, Inc. (Audubon, PA)
- …transfer (eg inductive coupling, power harvesting) is a plus + Familiarity with microelectronics packaging techniques (eg HIC, MCM, 3D-IC, wire bonding) is a ... industry standards and performance metrics (eg Bluetooth, IEC 60601-1, etc) + Lead the design, build, and test of microcontroller-based systems + Translate product… more