• Principal Engineer - HBM SOC…

    Micron Technology, Inc. (Richardson, TX)
    …lowest power per bit solutions in the industry. **Position Overview:** As a ** Principal HBM SOC Design and Integration Engineer ** , you will design ... Products Group (TPG) We are dedicated to developing and optimizing High Bandwidth Memory ( HBM ) solutions for AI and ML applications. Our ultimate goal is to deliver… more
    Micron Technology, Inc. (06/20/25)
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  • Principal HBM Design

    Micron Technology, Inc. (Atlanta, GA)
    …(5) years of progressive, postbaccalaureate experience in job offered or in a Principal HBM Design Engineerrelated occupation. Position also requires ... Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design HBM products that optimize all manufacturing functions and… more
    Micron Technology, Inc. (06/21/25)
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  • Staff/ Principal SoC Design

    Micron Technology, Inc. (Richardson, TX)
    …power per bit solutions in the industry! **Position Overview:** Micron is hiring a Staff/ Principal Engineer - HBM SOC Design and Integration! You will ... are dedicated to developing and optimizing High Bandwidth Memory ( HBM ) solutions for AI and ML applications. Our ultimate... design and develop next-generation HBM DRAM products. You will collaborate with domain experts… more
    Micron Technology, Inc. (04/15/25)
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  • Principal SOC Pre-Silicon Verification…

    Micron Technology, Inc. (Richardson, TX)
    …the Technology and Products Group (TPG). We are developing High Bandwidth Memory ( HBM ) solutions for AI and ML applications. Using TSV (Through Silicon Via), we ... the lowest power per bit solutions in the industry. HBM team is growing! We're looking for a verification...be part of a multi-functional team of experts in Design Engineering, Product Engineering, Process Development, Package Engineering &… more
    Micron Technology, Inc. (06/21/25)
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  • Heterogenous Integration IO Interposer Architect,…

    Micron Technology, Inc. (Richardson, TX)
    …of high-speed interface, interposer, power distribution networks (PDN) partnering with IO design in next-generation HBM products. In this position, you will ... will include, but are not limited to:** + Analyze HBM cube PDN integration partnering with IO design + Pathfinding to explore new HBM architectures,… more
    Micron Technology, Inc. (04/17/25)
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  • Principal /MTS Memory System Architect…

    Micron Technology, Inc. (Boise, ID)
    …Intro:** The Micron Module Architecture team is seeking a highly skilled and experienced Principal Engineer , or Member of Technical Staff! This role would be a ... electrical, mechanical, thermal, and power specs. You will drive the board-level design (BLD) process, ensuring the successful integration of hardware components and… more
    Micron Technology, Inc. (06/12/25)
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  • Signal & Power Integrity Principal

    Micron Technology, Inc. (Boise, ID)
    …than ever. Micron is searching for our next Signal & Power Integrity engineer ! Micron's Signal Integrity High Performance Memory Systems Group drives the high-end ... high-performance high-speed product signaling and power designs for products like HBM , GDDR, LPDRAM, DDR5/DDR6, PCIeGen6 and sophisticated signaling development. We… more
    Micron Technology, Inc. (06/12/25)
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  • Principal Software Engineer

    Microsoft Corporation (Redmond, WA)
    …advance them through technical readiness for productization. The LEAP team is seeking a ** Principal ** **Software Engineer ** who will be part of the team to ... develop hardware/software co- design , software prototyping, and building reference designs to enable...and advanced memory tiering/pooling architectures such as CXL and HBM . + Engage with Azure operators and customers to… more
    Microsoft Corporation (06/18/25)
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