- Henkel (Irvine, CA)
- … advanced packaging environment. + Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package + Expertise in ... Principal Application Engineer _ Semiconductor Advanced Package **_About_** **_this_** **_position_** At Henkel, you'll be part of an organization that's shaping the… more
- SanDisk (Milpitas, CA)
- … Packaging Engineering organization. This role requires a strong background in semiconductor packaging technologies, as well as the ability to navigate ... the semiconductor industry with a strong focus on Semiconductor Packaging Technologies. + Demonstrated success in strategic or operational leadership roles… more
- Micron Technology, Inc. (Boise, ID)
- …who is optimistic and responsible. **Job Responsibilities:** + Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …Process Control (SPC), Defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …Process Control (SPC), defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront ... of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated… more
- Teradyne (North Reading, MA)
- …or Masters in Engineering a plus. + Solid understanding of modern digital semiconductor development - design, DFT, fabrication process, packaging , and device ... integrate and excel across segments, positioning Teradyne as the go-to provider in semiconductor testing. By partnering with a diverse range of customers - from… more
- Micron Technology, Inc. (Boise, ID)
- …and extracting valuable insights from large datasets related to semiconductor manufacturing, process optimization, and quality control. You'll collaborate with ... Analysis & Anomaly Detection:** Perform exploratory data analysis (EDA) on semiconductor manufacturing data, including wafer fabrication, yield, and defect rates.… more
- Micron Technology, Inc. (Boise, ID)
- …Electrical Engineering, or related field + 5+ years of experience in Advanced Packaging Technology metrology or RDA development for semiconductor products + ... equipment concepts **Preferred Experience:** + 8+ years working directly with Advanced Packaging metrology or RDA development in the semiconductor industry +… more
- Micron Technology, Inc. (Boise, ID)
- …Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated ... half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform...technology development across Planar DRAM, Advanced DRAM, and Advanced Packaging TD. As a Process Quality Engineer, you will… more
- Micron Technology, Inc. (Richardson, TX)
- …For over 43 years, Micron has led the industry in developing advanced semiconductor solutions that power applications from virtual reality to neural networks. The ... Contribute to architectural decisions impacting high-performance computing and 2.5D/3D packaging . + Communicate technical findings and compose insights for internal… more
- Teradyne (North Reading, MA)
- …Overview The Innovation Lab is an advanced R&D team that is part of the Semiconductor Test Division at Teradyne. We have a dual charter to technically support the ... division and company: + Create long-term differentiated solutions for our core Semiconductor Test business by exploring new technologies and architectures to be… more
- Micron Technology, Inc. (Boise, ID)
- …Engineering, Physics, or related field. + 7+ years of experience in semiconductor package design, manufacturing, or Quality & Reliability (Q&R). + Experience with ... advanced packaging technologies (eg, 3DI, Wafer-2-Wafer, SiP). + Expert-level applied knowledge of package-level and board-level reliability test methods,… more
- Teradyne (North Reading, MA)
- …Overview The Innovation Lab is an advanced R&D team that is part of the Semiconductor Test Division at Teradyne. We have a dual charter to technically support the ... division and company: + Create long-term differentiated solutions for our core Semiconductor Test business by exploring new technologies and architectures to be… more
- Micron Technology, Inc. (Boise, ID)
- …experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging . + Position level will be determined based on education and experience. ... supporting the growth of our DRAM, HBM, and Advanced Packaging functions. **What You'll Do** As a Workforce Development...As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing… more
- Micron Technology, Inc. (Boise, ID)
- …memory architectures, system memory hierarchy, and compute system architectures. + Exposure to packaging technologies such as TSV, stacked packaging , and 3D ... not include bonus, equity, or benefits. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.… more
- Renesas (San Jose, CA)
- …**Collaboration with Cross-functional Teams** : Work closely with design, product, test, packaging and other teams to ensure DDR5 solutions meet all performance and ... to learn more about our many benefits and resources Renesas is an embedded semiconductor solution provider driven by its Purpose ' **To Make Our Lives Easier** .'… more
- Micron Technology, Inc. (Boise, ID)
- …opportunities for, and drive, performance scaling through innovative circuit, signaling, packaging and interconnect solutions with a 3-5 year outlook, and to ... and organizations including Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration. Qualifications Successful candidates for this… more
- Micron Technology, Inc. (Boise, ID)
- …areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)! **Responsibilities:** + Development of future ... improvement in performance scaling, signaling, and sophisticated packaging + Leverage modeling and simulation methodology to improve accuracy to signal integrity… more
- Advanced Energy (Eden Prairie, MN)
- …complex applications for a wide range of industries including semiconductor equipment, industrial, manufacturing, telecommunications, data center computing and ... the RFQ + Guide responsible engineers to work on the electrical and mechanical packaging approach for cost breakdown + Lead in drafting the technical proposal and… more
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