• Postdoctoral Scholar in Semiconductor

    Pennsylvania State University (University Park, PA)
    …State is seeking a Postdoctoral Scholar. The successful candidate will work on semiconductor packaging , with a focus on integrating new materials, developing new ... will also mentor graduate students working in the area of semiconductor packaging . A PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or… more
    Pennsylvania State University (04/17/24)
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  • Sr/Engineer - Semiconductor Advanced…

    Micron Technology, Inc. (San Jose, CA)
    …shifts. **Job Responsibilities** : - **Process Operation** : Monitor and control semiconductor packaging processes across various equipment and tools, ensuring ... - **Process Optimization** : Collaborate with process engineers to optimize semiconductor packaging processes for improved yield, reliability, and performance.… more
    Micron Technology, Inc. (03/29/24)
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  • Sr/Shift Technician - Semiconductor

    Micron Technology, Inc. (Boise, ID)
    …with hands-on experience in equipment operation and maintenance. Experience with semiconductor packaging processes is advantageous. **Technical Skills** : Basic ... play a crucial role in supporting operations and maintenance of the semiconductor sophisticated packaging pilot line, including manual handling, loading of… more
    Micron Technology, Inc. (04/17/24)
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  • Semiconductor Packaging Engineer

    Daktronics (Brookings, SD)
    …Science, Applied Chemistry, or related fields. + Preferred: + Experiences in semiconductor fabrication emphasizing wafer level and flip-chip packaging . + Strong ... on advances and innovation in uLED, uIC, wafer level packaging , and flip chip interconnects. + Participate in ...packaging , and flip chip interconnects. + Participate in packaging uLED roadmap development and execution. + Identify, benchmark,… more
    Daktronics (02/13/24)
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  • Semiconductor Engineering Position…

    IBM (Yorktown Heights, NY)
    semiconductor process engineer with a focus on processes related to semiconductor packaging physical vapor deposition (PVD) and thermal compression bonding ... compressive bonding is important. Capability of learning new processes and semiconductor packaging tools quickly is also key. Driving improvements with processes… more
    IBM (04/03/24)
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  • Member of Technical Staff - Advanced…

    Micron Technology, Inc. (Boise, ID)
    …+ 10+ yrs. experience in Process Engineering for Far Back End Interconnects, Semiconductor Packaging , Semiconductor Assembly, Interposers and or SoC ... It is a super exciting time to join the semiconductor industry and advances in packaging technology...join the semiconductor industry and advances in packaging technology will revolutionize the applications in which semiconductors… more
    Micron Technology, Inc. (01/25/24)
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  • Focal Plane Array Packaging Engineer

    Actalent (Camarillo, CA)
    …or related fields with a minimum of 3-5+ years * Expertise in semiconductor packaging , including wire bonding and epoxy die attach/bonding. * Experience ... focusing on process yield, capability, and throughput. * Apply knowledge of packaging , semiconductor processing, and device physics to enhance FPA development… more
    Actalent (04/23/24)
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  • Packaging Engineer, Sensors (Avionics)

    SpaceX (Hawthorne, CA)
    …to transition cutting-edge sensors to high-volume production. RESPONSIBILITIES: + Develop MEMS/ semiconductor packaging processes and qualify those processes for ... semiconductor devices from development to production + MEMS or semiconductor packaging experience, including one or more of the following: dicing, die-attach,… more
    SpaceX (03/16/24)
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  • Principal IC Packaging Engineer, Silicon…

    SpaceX (Bastrop, TX)
    …are looking for hands-on and dynamic engineers with expertise in advanced semiconductor packaging assembly design, development, equipment, and testing. You will ... other applied engineering discipline + 10+ years of professional experience in semiconductor assembly and packaging PREFERRED SKILLS AND EXPERIENCE: + Advanced… more
    SpaceX (04/09/24)
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  • Sr. Principal Process Engineer/Principal Process…

    Northrop Grumman (St. Charles, MO)
    …+ Experience with Design of Experiments methodologies. + Experience with semiconductor packaging , specifically eutectic solder attach, reflow ovens, and ... + Experience with Design of Experiments methodologies. + Experience with semiconductor packaging , specifically eutectic solder attach, reflow ovens, and… more
    Northrop Grumman (04/19/24)
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  • Silicon Packaging Engineer

    Meta (New York, NY)
    …and foundry partners 26. Proven technical understanding of full range of semiconductor packaging materials, material interactions, SMT processes, PCB design and ... **Summary:** Meta is looking for an experienced Silicon Packaging Engineer for its Ecosystem and Technical Operation team. The ideal candidate will be able to… more
    Meta (04/09/24)
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  • Associate Process Engineer (Laser Diode…

    Northrop Grumman (St. Charles, MO)
    …+ Familiarity with Design of Experiments methodologies. + Experience with semiconductor packaging , specifically eutectic solder attach, reflow ovens, and ... . Job Duties + Develop new manufacturing processes associated with the packaging /soldering of semiconductor laser diodes. + Responsible for laser diode… more
    Northrop Grumman (04/19/24)
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  • Senior Staff Packaging Engineer

    Power Integrations (San Jose, CA)
    …Mechanical Engineering, Material Science. + Minimum experience 12 years in semiconductor packaging technology. + Experience leaded multi-die packages. + ... or passive integrated package assembly is a plus. + Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and… more
    Power Integrations (04/17/24)
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  • Packaging Engineer E5

    Applied Materials (Santa Clara, CA)
    …diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging . Key attributes of a successful candidate: + Domain ... expertise in W2W hybrid and fusion bonding with deep understanding of materials, process device physics and integration. + Ability to drive new materials and process development to enable 3D NAND pitch scaling through structured problem solving methodology. +… more
    Applied Materials (04/23/24)
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  • Postdoctoral Researcher- III-V…

    National Renewable Energy Laboratory (Golden, CO)
    …candidate will have expertise in III-V optoelectronic device fabrication, clean room semiconductor processing, and device packaging and assembly; and in one ... **Posting Title** Postdoctoral Researcher- III-V Semiconductor Metallization and Processing Development . **Location** CO - Golden . **Position Type** Postdoc (Fixed… more
    National Renewable Energy Laboratory (01/30/24)
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  • Hardware Designer

    CTG (Yorktown Heights, NY)
    Packaging /Microfabrication Team is working with teams in nanotechnology, advanced semiconductor packaging , biosensors, quantum computing and advanced wafer ... second shift process engineering positions are open in the Packaging /Microfabrication lab in Yorktown, NY. The Packaging /Microfabrication...semiconductor technology projects. Currently the … more
    CTG (04/11/24)
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  • Strategic Student Program: Advanced…

    Siemens Digital Industries Software (Cary, NC)
    …learning environment, gaining hands-on experience in cutting-edge technologies related to advanced packaging and semiconductor design. + Work under the guidance ... time offers after university graduation and completion of the program **Advanced Packaging Flow Development Intern** **EDA Global Sales** Siemens EDA, a leader in… more
    Siemens Digital Industries Software (04/19/24)
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  • Hardware Developer - Process Integration Engineer

    IBM (Albany, NY)
    …who will push boundaries in the integration of advanced logic and next generation semiconductor packaging technologies. In this role, you will be responsible for ... integration, hybrid bonding, temporary bonding-debonding, bumping, wafer level fan out, semiconductor packaging technology. 3) Experience or knowledge in… more
    IBM (04/02/24)
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  • High Frequency Passive Component and Circuit…

    Ford Motor Company (Dearborn, MI)
    …high temperature circuit design, to integrate filtering solutions with power semiconductor packaging . + Understanding automotive applications and requirements. + ... and cost impact of various filter and snubber topology. + Knowledge in semiconductor devices and correlation between semiconductor switching process and high… more
    Ford Motor Company (03/19/24)
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  • Engineer Microelectronic Semiconductors…

    Northrop Grumman (Apopka, FL)
    …Advanced Packaging Technology u-Line in Apopka, Florida. Northrop Grumman's semiconductor foundry, packaging , integration, and test lines have unique ... Apopka Florida wafer bumping u-Line will support flip chip, 2.5D, and 3D packaging for internal and external production customers as well as emerging technology… more
    Northrop Grumman (04/19/24)
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