- Micron Technology, Inc. (Boise, ID)
- …for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, ... advanced packaging team responsible for next generation high bandwidth memory ( HBM ) pathfinding and development. You will be responsible for developing CMP… more
- NVIDIA (Santa Clara, CA)
- …latest GPU architectures, built in powerful process technology + Analyze and root cause product yield limiters at wafer sort and package level on Automatic Test ... Have opportunity to influence future ASIC designs to improve product quality , test coverage to drive yields...to stand out from the crowd: + Background with DRAM/ HBM Testing and 2.5D assembly + Experience with silicon… more
- Micron Technology, Inc. (Boise, ID)
- …(C-mode scanning acoustic microscope), PYE ( Product Yield Enhancement), Product Engineering, Package Reliability, and AQL (Acceptable Quality Level) + ... the electrical characterization and electrical failure analysis (EFA) of all assigned product types: Compute/Mobile/Graphics DRAM, HBM , and others. You will use… more