- Apple Inc. (San Francisco, CA)
- …to develop new substrate technologies from concept to HVM for Apple packaging roadmap. Work with cross‑functional groups to define & optimize new package ... San Francisco Bay Area, California, United States Hardware Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging … more
- Eridu Corporation (San Francisco, CA)
- …augmented reality contact lens). Position Overview We are seeking an Advanced Packaging Engineer to lead the development, integration, and production enablement ... of next-generation multi-die packaging solutions, including 2.5D CoWoS, bridge-based, and high-density chiplet assemblies. This role drives end-to-end packaging … more
- Eliyan (San Francisco, CA)
- …leading chiplet startup from the ground floor! As a Signal and Power Integrity Engineer , you will provide packaging solutions for chiplet interconnects in a ... design, modeling, manufacturing, assembly, and testing of traditional and advanced packaging for Eliyan's chiplet solutions. You will work with a cross-functional… more
