• SanDisk (Milpitas, CA)
    …through academic coursework or experience required in thermal modeling and measurements of IC packaging and related areas. + A strong background in thermal ... work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and… more
    DirectEmployers Association (09/05/25)
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  • IC Packaging Principal

    Cadence Design Systems, Inc. (San Jose, CA)
    IC Package Routing, Technologies, and Flows. Location; San Jose, CA, on-site. As an IC Packaging Product Engineer, you will be responsible for driving ... looking for a candidate to be part of its Product Engineering Team in the System Design and Analysis...innovation and expanding Cadence IC Packaging Advanced Routing and Automated Solutions… more
    Cadence Design Systems, Inc. (10/17/25)
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  • Principal , Supply Chain Eng. & Ops

    Microsoft Corporation (Mountain View, CA)
    …within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. ... optimize the Cloud infrastructure. We are looking for a ** Principal , Supply Chain Eng. & Ops** to join the...support of Division Operations such that our various multi-generation product platforms are delivered on schedule and on budget.… more
    Microsoft Corporation (10/23/25)
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