- BAE Systems (Cedar Rapids, IA)
- …may be available based on position level and/or job specifics. ** Microelectronics Packaging Engineer - ( Hybrid )** **117849BR** EEO Career Site Equal ... independent work, it will take the form of a hybrid work format, with time split between working onsite...or Materials Engineering to join our team as a Microelectronics Packaging Design Engineer . As… more
- BAE Systems (Cedar Rapids, IA)
- …on position level and/or job specifics. **Senior Mechanical Engineer - Microelectronics Packaging ( Hybrid )** **114793BR** EEO Career Site Equal ... independent work, it will take the form of a hybrid work format, with time split between working onsite...and the desire to work in the world of Microelectronics Packaging Design. Our team needs engineers… more
- BAE Systems (Cedar Rapids, IA)
- **Job Description** Job Description: Join our team at BAE Systems as a Microelectronics Packaging Design Engineer intern and work on cutting-edge projects ... that shape the future of aerospace and defense. Our hybrid work format allows for a balance of collaborative...the industry's most difficult problems. Internship Summary: As a Microelectronics Packaging Design Engineer intern,… more