- Siemens Digital Industries Software (Fremont, CA)
- …for an opportunity to serve as a Design for Test (DFT) design lead in our 3D IC Solutions Engineering team in driving the development of comprehensive, end ... IC package designs. The DFT design lead will work closely with the 3D IC solutions teams to integrate the DFT Test IO planning into the respective… more
- Siemens Digital Industries Software (Fremont, CA)
- …high performing individual for an opportunity to serve as a technical lead of our 3D IC Solutions Engineering teams in driving the development of ... driving the technical requirements, specification, and implementation of the 3D IC workflows. The technical lead with...EDA tools and design methods including: o 2.5D and 3D solutions (Si Interposer, FOWLP Package and… more
- Siemens Digital Industries Software (Fremont, CA)
- …individual for an opportunity to serve as the Signal/Power Integrity Analysis Lead in our 3D IC Solutions Engineering team in driving the development of ... the 3D IC design. An additional responsibility is to work with 3D IC solutions teams to develop and validate the extraction scripts to facilitate a… more
- Siemens Digital Industries Software (Fremont, CA)
- …performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering team in driving the development of ... components (excluding the chiplet devices). Additional responsibilities include working with the 3D IC Solutions teams in integrating the other 3D … more
- Siemens Digital Industries Software (Fremont, CA)
- …working individual for an opportunity to serve as a chiplet design lead in our 3D IC Solutions Engineering team in driving the development of comprehensive, ... IC package designs. An additional responsibility is to work with the 3D IC Solutions package design lead and place and route engineering team to develop… more
- Siemens Digital Industries Software (Fremont, CA)
- …individual for an opportunity to serve as a senior thermal/stress analysis lead in our 3D IC Solutions Engineering team in driving the development of ... to support the thermal and thermal-mechanical stress analysis of 2.5/ 3D IC package designs. This analysis leverages...EDA tools and design methods including: o 2.5D and 3D solutions (Si Interposer, FOWLP Package and… more
- Siemens Digital Industries Software (Fremont, CA)
- …self-starting, motivated, and high performing individual for an opportunity in working with our 3D IC Solutions Engineering teams on the development of ... for this position will be in working with the 3D IC Solutions Engineering teams...testing and validation of these workflows. The software infrastructure engineer will also provide technical support and guidance to… more
- Meta (Menlo Park, CA)
- …18. Experience with optical integration including InP PICs, Silicon-photonic PICs, PIC- IC integration, and 3D optical packaging technologies. **Public ... mission of bringing the world together. We are looking for an Optical Engineer to qualify optical communications modules for Meta's cutting-edge, global, data center… more