• IC Packaging Principal

    Cadence Design Systems, Inc. (San Jose, CA)
    …of the Cadence tool set in the context of multiple flows including IC Packaging , high speed design, signal integrity and electrical constraints definition. ... Design experience and industry knowledge of current IC Packaging Design and manufacturing processes is required. Knowledge of advanced IC packaging flows… more
    Cadence Design Systems, Inc. (05/23/25)
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  • Principal Manager, GTM, Product Growth…

    Rubrik (Palo Alto, CA)
    …This lead will drive the creation of monetization strategy proposals, application of new monetization models, pricing promotions, and competitive takeouts. and ... management and business operations teams to implement pricing and packaging changes within the product and the quote to...of reasonable accommodation include making a change to the application process or work procedures, providing documents in an… more
    Rubrik (04/16/25)
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  • Principal Engineer, Packaging

    SanDisk (Milpitas, CA)
    …computational and/or experimental solid mechanics, is required. In-depth knowledge of IC packaging is highly desired. **Qualifications** REQUIRED: + Ph.D. ... academic coursework or experience required in mechanical engineering of IC packaging and related areas. + Strong...applying. Based on our experience, we anticipate that the application deadline will be **08/01/2025** (3 months from posting),… more
    SanDisk (05/02/25)
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  • Principal Engineer, Packaging

    SanDisk (Milpitas, CA)
    …through academic coursework or experience required in thermal modeling and measurements of IC packaging and related areas. + A strong background in thermal ... our world moving forward. **Job Description** ESSENTIAL DUTIES AND RESPONSIBILITIES: + As a Packaging Engineer, you will work in the Packaging R&D group on… more
    SanDisk (05/31/25)
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