- IBM (Yorktown Heights, NY)
- **Introduction** IBM Quantum is seeking talented engineers to join the quantum hardware design/simulation team at the IBM Thomas J. Watson Research Center in ... research team focused on developing the next generation of packaging and system-level interconnect for IBM Quantum 's...of packaging and system-level interconnect for IBM Quantum 's quantum processing units. The role will… more
- Google (Goleta, CA)
- …years of experience in characterization of reliability and yield of advanced electronics packaging hardware . + 5 years of experience in package techniques ... packaging development efforts and projects. As a Senior Packaging Research and Development Engineer , you will...intuition to develop the understanding needed to improve superconducting quantum hardware system performance, and to pave… more
- IBM (Rochester, MN)
- …analysis, and 1st level chip packaging integration methodologies that enable hardware in Quantum systems. Additionally, members of this department partner ... an opening for an entry level 1st Level Chip Packaging Development Engineer . As a member of...with IBM Research on Custom Chip/Wafer Scale Integration and Quantum Cryogenic hardware development. Team members of… more
- IBM (Rochester, MN)
- …IBM Infrastructure has an opening for an experienced Signal and Power Integrity/System Hardware Developer Engineer . As a member of this elite team of ... serial channel analysis and power domain analysis that enable hardware in Quantum Systems. Team members of.... Familiarity with Microprocessor and ASIC 1st Level Chip Packaging and Hardware Development . Demonstrated experience… more
- Leonardo DRS, Inc. (San Diego, CA)
- …"To protect with Light". Come join the family!_ **Job Summary** The Senior Laser Packaging Engineer at Daylight will be responsible for supporting the design and ... technology for government and commercial markets, including defense and security, quantum information sciences, life sciences, and industrial process control. As a… more
- Google (Goleta, CA)
- …+ Experience in MEMS device fabrication, 3D integration, and wafer level packaging . + Experience with etching, thin film, materials characterization, CAD tools, ... wafer level probing, failure analysis, and packaging . In this role you will be developing new...collaborate effectively with fellow teammates. The full potential of quantum computing will be unlocked with a large-scale computer… more
- Vector Atomic (Pleasanton, CA)
- …Design and develop hardware components for both existing and novel quantum devices. + Integrate optical mounts, laser packaging , and electromechanical ... About Vector Atomic Vector Atomic is building quantum devices for applications including GPS-free navigation and...technologies within a collaborative, innovative environment! As a Mechanical Engineer at Vector Atomic, you will play a critical… more
- Northrop Grumman (Linthicum Heights, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... Applications (MDA), which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems. Our… more
- IBM (Rochester, MN)
- …high-speed serial channel analysis for flexible printed circuit board development that enable hardware in Quantum systems. Team members of this department impact ... Infrastructure has an opening for an experienced Flexible Interconnect Signal Integrity Engineer . As a member of this elite team of engineering professionals, you… more
- Northrop Grumman (Linthicum Heights, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... Applications (MDA), which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems. MDA is… more
- Northrop Grumman (Beavercreek, OH)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... Applications (MDA), which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems. MDA is… more
- Northrop Grumman (Annapolis Junction, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... Applications (MDA), which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems. MDA is… more
- Northrop Grumman (Linthicum Heights, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... Applications (MDA), which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems. MDA is… more
- Northrop Grumman (Linthicum Heights, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... Applications (MDA), which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems. MDA is… more
- Northrop Grumman (Linthicum Heights, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... Applications (MDA), which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems. MDA is… more
- Leonardo DRS, Inc. (San Diego, CA)
- …technology for government and commercial markets, including defense and security, quantum information sciences, life sciences, and industrial process control. As a ... with Light". Come join the family!_ **Job Summary** The Senior Opto-Mechanical Engineer at Daylight will be responsible for supporting the design and analysis… more
- MIT Lincoln Laboratory (Lexington, MA)
- …CMOS electronics, semiconductor diode lasers and amplifiers, superconducting electronics and quantum bit (qubit) devices, and photonic integrated circuits (PICs). To ... characterization, fabrication (eg, silicon, compound-semiconductor, wafer bonding, flip-chip hybrid), packaging , and testing of electronic and photonic circuits. These… more
- Northrop Grumman (Annapolis Junction, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... Applications (MDA), which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems. MDA is… more