- Micron Technology, Inc. (San Jose, CA)
- …WoW, InFO, and other chiplet/SiP architectures. + Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product ... world to learn, communicate and advance faster than ever. As an Advanced Packaging and Systems Interface Architect in the Mobile Business Unit(MBU), you will lead… more
- Micron Technology, Inc. (Boise, ID)
- …and other chiplet/SiP architectures. + Experience with wafer bumping, wafer bonding, package assembly, substrate technology, BOM selection, testing and product ... In this role, you will be a technical leader in Micron's Advanced Packaging strategy and drive technical innovation and engagement with both internal and external… more
- Micron Technology, Inc. (Austin, TX)
- …WoW, InFO, and other chiplet/SiP architectures. + Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product ... to learn, communicate and advance faster than ever. As an Advanced Packaging Distinguished Member of Technical Staff/Fellow in the Compute and Networking Business… more
- Siemens Digital Industries Software (Wilsonville, OR)
- …3D IC designs. These workflows include package floor planning, package /chiplet level functional/ IO planning, interposer/ substrate planning, layout, ... performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering...Working knowledge (3-5 years of experience preferred) of Advanced Packaging IC EDA tools and design methods including: o… more