• Sr . Wafer Bonding

    Micron Technology, Inc. (Boise, ID)
    …inspiring the world to learn, communicate and advance faster than ever. As a wafer bonding process engineer within our DRAM Technology Development ... a world-wide memory development organization. You will be responsible for developing wafer bonding process technology which will enable Micron to develop… more
    Micron Technology, Inc. (04/20/24)
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  • Sr NAND Process Development Engineer…

    Micron Technology, Inc. (Boise, ID)
    …fundamental understanding of bond process and equipment interactions. + Experience in wafer bonding process development and understanding of bonding ... Process and Equipment Development Engineer in the NAND wafer bonding R&D team, you will be...technical fields. + 3 to 5 years of semiconductor process engineering experience in wafer bonding more
    Micron Technology, Inc. (03/01/24)
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  • Sr . DRAM Process Integration…

    Micron Technology, Inc. (Boise, ID)
    …front of line, middle of line, interconnect of DRAM modules. + Experience of process integration with wafer bonding technology. + Device Physics, Electronics ... learn, communicate and advance faster than ever. As a Sr . or Principal DRAM Process Integration Pathfinding Engineer within the Technology Development group at… more
    Micron Technology, Inc. (04/16/24)
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  • Sr . Process Integration Engineer…

    Micron Technology, Inc. (Boise, ID)
    …programs. More specifically, you will develop sophisticated interconnect technology solutions that include wafer to wafer bonding , using Hybrid Bonding , ... a strong work ethic and integrity to join our Wafer Level Packaging Technologies Team in Boise, Idaho. As...or Fusion bonding . You will integrate process flows that involve thinning of wafers and through… more
    Micron Technology, Inc. (04/24/24)
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  • Sr /Shift Technician - Semiconductor…

    Micron Technology, Inc. (Boise, ID)
    …handling, loading of lots, and system requests across CMP, WET, ETCH, PHOTO, CVD, bonding , debonding, TCD, wafer preparation, hybrid bonding , pre- and ... manufacturing processes and equipment, including CMP/ WET / ETCH/ PHOTO/ CVD/ bonding / debonding/ TCD/ wafer preparation/ hybrid bonding / encapsulation… more
    Micron Technology, Inc. (04/17/24)
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  • SMTS/Dmts, Advanced Packaging Architect

    Micron Technology, Inc. (Boise, ID)
    …WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures. + Experience with wafer bumping, wafer bonding , package assembly, substrate technology, ... inspiring the world to learn, communicate and advance faster than ever. As an Senior Member of Technical Staff or Distinguished Member of Technical Staff in Advanced… more
    Micron Technology, Inc. (03/02/24)
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