- IBM (Albany, NY)
- …in the area of process technology for semiconductors and related devices, including wafer polishing, wafer grinding, wafer edge trimming with emphasis in ... wafer bonding, hybrid metal/insulator wafer bonding, temporary adhesive wafer bonding, and wafer debonding process . These process technologies are… more
- IBM (Albany, NY)
- …with cross-functional and multi-company working teams that include engineers engaged in unit process development, materials and process development, ... Responsibilities IBM Research at Albany, NY is seeking a process integration engineer who will push boundaries...or more of these areas: thru silicon via (TSV) process integration, hybrid bonding, temporary bonding-debonding, bumping, wafer… more