- Global Foundries (Malta, NY)
- …to network with executives. Summary of Role: Intern engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes ... verbal communication skills + Strong planning & organizational skills + Any Advanced Semiconductor Packaging or Semiconductor Integration experience a big plus… more
- Insight Global (Austin, TX)
- … Engineer will focus on processing of test and demonstration vehicles in advanced Heterogeneous Integration projects. This role will initially involve ... Develop successful shortloop and full integrated processes to demonstrate various heterogeneous integration prototypes. Significant hands-on role within the… more
- Global Foundries (Malta, NY)
- …state-of-the-art 300mm fabrication facility in Malta, New York . This role will entail 3D heterogeneous integration (3DHI) design enablement to enable our ... etc.) that must be followed for an integrated circuit (IC) design to be manufacturable. + Advanced packaging liaison to the DM and PDK ( Process D esign K it) teams… more
- Global Foundries (Malta, NY)
- …continuing to develop solutions for differentiated technology. Enabling Silicon Photonics advanced packaging as it strives to offer heterogeneous solutions ... www.gf.com. Summary of Role: GLOBALFOUNDRIES is seeking a MTS engineer for its Advanced Silicon Photonics Packaging Technology Development team. In our advanced … more
- Northrop Grumman (Manhattan Beach, CA)
- …technology development in areas such as 3D Heterogeneous Integration , semiconductor materials, manufacturing processes, and advanced transistors. These ... advanced technological capabilities are crucial performance differentiators for many of Northrop Grumman's ground, avionic, and space systems. \#NGMC \#NGSPF The Northrop Grumman Microelectronics Center (NGMC) is seeking a **Manager Electronics Engineering… more
- Texas A&M University System (College Station, TX)
- …tools. + Working knowledge of chemical mechanical polishing, flip-chip bonding, and 2.5D/ 3D heterogeneous integration . + Ability to operate independently ... lithography, photolithography, thin film deposition (electroplating, PVD, CVD, and ALD), 3D printing, wafer bonding, reactive ion etching (ICP-RIE and DRIE),… more