- Global Foundries (Malta, NY)
- …by driving product packaging design reviews, materials selection and FMEAs of customer packaging concept s. + Driv es SiPh ad vanced packaging product ... individual contributor (as directed and/or independently), or as a manager : + P erform project management and data analysis...chip package interaction for 2D, 2.5D, 3D , 3.5D SiPh advanced packaging . + Broad and… more
- Global Foundries (Malta, NY)
- …product packaging design reviews, materials selection and FMEAs of customer packaging concepts. + Driving SiPh advanced packaging product innovations, ... for customers using a deep knowledge of package design architecture tradeoffs. CPO is one of the complex architectures...in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging . + Broad and deep… more
Locations:
New York