• Material and Process Engineer - Advanced…

    The Boeing Company (El Segundo, CA)
    …to work building the future! BR&T is looking to hire a **Material and Process Engineer - Advanced Microelectronics Packaging ** who will provide support to ... a background with materials science and extensive experience with microelectronics process development and production engineering. **Position Responsibilities:** +… more
    The Boeing Company (05/08/24)
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  • Sr Electronics Packaging Engineer

    Jacobs (Severn, MD)
    …take on challenges, and takes pride in their accomplishments. A Sr Electronics Packaging Engineer in the Special Projects division applies their engineering ... manufacturing, electronics packaging , structural, and thermal analysis. + The Sr Electronics Packaging Engineer will support in some or all of the following… more
    Jacobs (04/24/24)
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  • Analog Mixed Signal Integrated Circuit Design…

    The Boeing Company (Tukwila, WA)
    …(architecture definition, circuit design, RTL, synthesis, physical layout, verification, packaging and testing). SSED owns numerous microelectronics projects, ... BR&T, Boeing's Solid State Electronics Development organization (SSED) performs microelectronics technology development for aerospace systems. SSED develops digital,… more
    The Boeing Company (05/10/24)
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  • Custom IC Design Engineer (Associate,…

    The Boeing Company (Tukwila, WA)
    …(architecture definition, circuit design, RTL, synthesis, physical layout, verification, packaging and testing). SSED owns numerous microelectronics projects, ... cell design, analysis, verification and test. The Custom Integrated Circuit (IC) Design Engineer is expected to contribute all phases of design and development from… more
    The Boeing Company (05/05/24)
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  • Senior Specialist, Quality Engineering

    L3Harris (Palm Bay, FL)
    …Computer Engineering, Chemical Engineering or related STEM field + Prior semiconductor, advanced packaging , or microelectronics experience + A minimum of 6 years ... Quality Engineering position in support of a new advanced packaging and back-end-of-line (BEOL) wafer fabrication effort at our...authority for all aspects of Quality Assurance for the Microelectronics Division. As the business grows, so will the… more
    L3Harris (04/19/24)
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