- Micron Technology, Inc. (Boise, ID)
- …new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Die Bonding, you will be primarily responsible ... 8D or SPC/FDC methodology. **Responsibilities:** + Develop, diagnose, and resolve various die bonding process technologies + Coordinate and execute process… more
- Chart Industries (La Crosse, WI)
- Tool & Die Maker **Location:** La Crosse, WI, United States, 54601 **Company:** Chart Industries **_Ensuring Chart's Success _** "Cooler Together" - Chart's ... principal focus is the design and fabrication of cryogenic...the purpose of laying out and preparing of fin die blanks; performs die maintenance and repair… more
- Northrop Grumman (Linthicum Heights, MD)
- …military platforms. We are looking for you to join our team as a **Senior Principal ** **Microelectronics Process Engineer ** based out of **Linthicum, MD** . ... fabricate and assemble products at both the wafer and die levels. You will support process flow...**Basic Qualifications:** + Bachelor's Degree in Mechanical Engineering, Electrical Engineer , or Software Engineering with 8+ years of relevant… more
- Northrop Grumman (Linthicum Heights, MD)
- …into robust, repeatable, and cost-effective manufacturing flows. The Senior Principal Engineer will provide technical leadership, system-level perspective, ... making history. Northrop Grumman Mission Systems is seeking an accomplished **Senior Principal Microelectronics Engineer ** based out of Linthicum, MD to lead… more
- Northrop Grumman (Linthicum Heights, MD)
- …manufacturing as process integrator, system, software, IT, manufacturing, or process engineer + Experience developing test plans for verifying and ... for the position of ** Principal / Sr. Principal Factory Manufacturing Execution Systems Engineer ** to...recipes, and varying levels of manufacturing containers (lots, wafers, die , etc.) + Experience with core data groups in… more
- Northrop Grumman (Linthicum Heights, MD)
- …manufacturing as process integrator, system, software, IT, manufacturing, or process engineer . + Experience developing test plans for verifying and ... for the position of ** Principal / Sr. Principal Factory Manufacturing Execution Systems Engineer Lead**...recipes, and varying levels of manufacturing containers (lots, wafers, die , etc.). + Experience with core data groups in… more
- Northrop Grumman (Linthicum Heights, MD)
- …new energy-efficient computing systems. MDA is seeking a ** Principal / Sr. Principal Manufacturing Data Visualization Engineer ** to join our team and develop ... to make these technologies a reality. ** Principal / Sr. Principal Manufacturing Data Visualization Engineer ** **Responsibilities:** + Architect custom… more
- Micron Technology, Inc. (Boise, ID)
- …technology nodes, maintaining Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging, you will be ... optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management… more
- Northrop Grumman (Linthicum Heights, MD)
- …is required. **Preferred Qualifications for Senior Principal Semiconductor RF Test Engineer :** + Experience with wafer or die testing. + Direct hands-on ... Mission Systems is seeking an exceptionally talented, motivated, and creative **Senior Principal Semiconductor RF Test Engineer ** for our Advanced Technology Lab… more
- J&J Family of Companies (Santa Clara, CA)
- …tubing used in medical devices. Under minimal supervision, the Principal R&D Engineer will be responsible for leading process and equipment design, driving ... sonic pressure waves for the treatment of calcified plaque. **Position Overview** The Principal R&D Engineer (Extrusion Technology) serves as a subject matter… more
- Micron Technology, Inc. (Boise, ID)
- …Modeling Engineer to pioneer technology advancements! As an Advanced Modeling Principal Engineer at Micron, you will continuously uplevel your skills and ... Develop digital twins for fab technology co-optimization covering wafer, die , and package level models across tech nodes. +...is a huge plus. + Previous experience as a Process or PI engineer is an asset.… more
- Micron Technology, Inc. (Atlanta, GA)
- …digital and analog circuits including simulating, optimizing and floor planning HBM Base die and Core die circuits. Collaborate with the design and verification ... the efforts of multi-functional teams such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design HBM products that… more
- RTX Corporation (Andover, MA)
- … Engineering Department is seeking an individual to fulfill the role of a Principal Electrical Failure Analysis Engineer . This position will support programs and ... to work with engineers in other disciplines such as materials and chemistry. **The Principal Electrical Engineer - Failure Analysis job is in Andover, MA and… more
- Micron Technology, Inc. (Richardson, TX)
- …Engineering Group (DEG) Design Engineer at Micron Technology, Inc. and a Principal Engineer , you will be responsible for designing and analyzing digital and ... support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products to optimize all… more
- RTX Corporation (Andover, MA)
- …problems that create a safer, more secure world. Raytheon is seeking a Principal Quality Engineer to join the Radio Frequency Components team supporting ... and more. The ideal candidate will be able to utilize semiconductor process knowledge and strong analytical and communications skills to drive cost effective… more
- Global Foundries (Malta, NY)
- …team. The core responsibilities of this team involve ownership of process integration of Silicon Photonic devices from development, customer engagement to ... co-integration of RF, CMOS and photonics components onto a single product die . This monolithic solution also enables innovative packaging solutions, such as… more
- Micron Technology, Inc. (Boise, ID)
- …nodes, maintaining Micron's leadership in the industry. The Thermal Simulation Engineer will be directly involved in developing new and derivative advanced ... position, you will be influencing the Product power maps, die and package architecture, and Si BEOL design rules,...packaging development that are related to design, material and process interactions. In this position you will collaborate with… more
- Micron Technology, Inc. (Richardson, TX)
- …per bit solutions in the industry! **Position Overview:** We are searching for a Principal HBM IO Architecture Design Engineer own the development of the PHY ... IO on the interface die in HBM products. In this position, you will...with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to implement… more
- Global Foundries (Malta, NY)
- …co-integration of RF, CMOS and photonics components onto a single product die . This monolithic solution also enables innovative packaging solutions, such as ... attachment of fiber arrays, support for 2.5D packaging, and on- die lasers. GF is also developing custom silicon photonics...is for a BEOL (Back End Of Line) Integration Engineer to be a part of a Technology Development… more
- Access Dubuque (Dubuque, IA)
- …/ STRUCTURAL ENGINEER Engineering Services and Products Company Tool and Die Maker Sedona Staffing Services Welder / Welding Production Associate Sedona Staffing ... DUTIES AND RESPONSIBILITIES include the following. Other duties may be assigned. Process orders by making patterns and markers for the manufacturing floor. Determine… more