- Henkel (Irvine, CA)
- … advanced packaging environment. + Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package + Expertise in ... Principal Application Engineer _ Semiconductor Advanced Package **_About_**... who provides technical engineering support for Henkel's Advanced Packaging Material products and responsible for developing in depth… more
- Micron Technology, Inc. (Boise, ID)
- …other related field + 0-6 years of direct experience working as a process development engineer in an R&D environment + Knowledge of Advanced Package Integration ... the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- NY CREATES (Albany, NY)
- …of high-tech innovation and commercialization. Job Description: Job Description for Integration Development Engineer JOB SUMMARY The integration development ... Other reasonable duties assigned. Requirements: Minimum Requirements for Integration Development Engineer BS degree in Electrical Engineering, Materials… more
- Micron Technology, Inc. (Boise, ID)
- …5+ years of experience in Advanced Packaging Technology metrology or RDA development for semiconductor products + Strong knowledge of RDA tooling capability, ... in the industry. As a Principal RDA and Metrology Engineer in APTD, you will be primarily responsible for...directly with Advanced Packaging metrology or RDA development in the semiconductor industry + Data… more
- Micron Technology, Inc. (Boise, ID)
- …your work will be to address all Thermal aspects of 2.5D and 3D advanced packaging development that are related to design, material and process interactions. In ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at… more
- Micron Technology, Inc. (Boise, ID)
- …and Advanced Packaging functions. **What You'll Do** As a Workforce Development Engineer , you will: + Collaborate with engineering, manufacturing, and ... the world to learn, communicate and advance faster than ever. **Workforce Development Engineer ** **Technology & Products Group (TPG)** **Location: Boise, ID… more
- Micron Technology, Inc. (Boise, ID)
- …learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at ... future of technology! **Position Overview:** As a Senior Process Engineer in the APTD team, you will be primarily...(SPC), Defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental… more
- Micron Technology, Inc. (Boise, ID)
- …learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at ... Process Control (SPC), defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of… more
- Micron Technology, Inc. (Boise, ID)
- …teams, supporting technology development across Planar DRAM, Advanced DRAM, and Advanced Packaging TD. As a Process Quality Engineer , you will be recognized ... Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated… more
- Teradyne (North Reading, MA)
- …Overview The Innovation Lab is an advanced R&D team that is part of the Semiconductor Test Division at Teradyne. We have a dual charter to technically support the ... division and company: + Create long-term differentiated solutions for our core Semiconductor Test business by exploring new technologies and architectures to be… more
- Teradyne (North Reading, MA)
- …Overview The Innovation Lab is an advanced R&D team that is part of the Semiconductor Test Division at Teradyne. We have a dual charter to technically support the ... division and company: + Create long-term differentiated solutions for our core Semiconductor Test business by exploring new technologies and architectures to be… more
- Renesas (San Jose, CA)
- Staff Application Engineer Job Description We are seeking an experienced and highly motivated **Staff Application Engineer ** to join our team focusing on ... to enhance system power efficiency without compromising performance. + **Tool Development ** : Create and maintain bench automation software for data collection,… more
- Micron Technology, Inc. (Boise, ID)
- …communicate and advance faster than ever. **Principal** **Signal Integrity** ** Engineer ** **- Interface Pathfinding** Micron's Interface Pathfinding team serves as ... strategy and the engineering teams through forward-looking investigation and development of energy-efficient bandwidth solutions in support of sustained technology… more
- Micron Technology, Inc. (Boise, ID)
- …subject areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)! **Responsibilities:** + Development of ... products like HBM, GDDR, LPDRAM, DDR5/DDR6, PCIeGen6 and sophisticated signaling development . We handle the interconnect and signaling exploration and development… more
- Micron Technology, Inc. (Boise, ID)
- …to learn, communicate and advance faster than ever. As a CMBU Systems Architecture Engineer at Micron Technology, you will have the opportunity to establish a deep ... implementation of new product concepts. Working closely with Product and Business Development Managers you will ensure that each technical decision is aligned with… more
- Meta (Sunnyvale, CA)
- …III-V material physics, especially LEDs and microLEDs 21. Expertise in advanced semiconductor packaging technologies such as COWOS, wafer reconstitution, InFO, ... We are looking for a highly skilled and driven Semiconductor Display Product Test Engineer to join...integration process. You will work cross-functionally with design, systems, packaging , and other XFN teams to ensure robust, scalable,… more
- Lockheed Martin (Goleta, CA)
- …accredited college in Engineering, Physics, or related discipline\. * Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with ... as epoxy die attach/bonding, polishing, substrate removal, or Anti\-Reflection \(AR\) coating or semiconductor packaging techniques\. * Must be a US Citizen, as… more
- Northrop Grumman (Elkridge, MD)
- …history, they're making history. Northrop Grumman is seeking a Sr Principal Manufacturing Engineer to be located at our Mission Systems Sector in **Elkridge, MD** . ... environment where he/she will interact with multiple disciplines. **Process Development ** + Developing new and maintaining, or improving, existing manufacturing… more
- Texas Instruments (Dallas, TX)
- …**About the Position** **Kilby Labs is seeking a highly motivated and experienced Optical Packaging Engineer to lead the development and implementation of ... **Optical Packaging Engineer ** **Location: Dallas, TX or...related field.** + **5+ years of relevant experience in semiconductor package/process development , including modeling, test … more
- Broadcom (Irvine, CA)
- … Package Designer** **Role Overview** We are seeking an experienced IC Packaging Engineer to drive next-generation package architecture, design, and ... / assembly technologies. **Program Management & Cross-Functional Execution** + Own packaging deliverables from concept through substrate design, development ,… more
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