• Senior /Principal Equipment Development…

    Micron Technology, Inc. (Boise, ID)
    …and advance faster than ever. Welcome! We at Micron Technology are seeking a Sr ./Principal Equipment Development Engineer ( Wafer Bonding ) to join our R&D ... a Senior /Principal Equipment Development Engineer in TD's wafer bonding Tech Dev (TD) team, you... process and equipment interactions. + Experience in process development for wafer bonding more
    Micron Technology, Inc. (08/23/24)
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  • Sr Principal, Wafer Bonding

    Skyworks (Irvine, CA)
    Sr Principal, Wafer Bonding ...Process experts, Operations, and suppliers as well. The Wafer Bonding Integration Engineer will be part ... Description Skyworks is seeking a highly skilled and experienced Wafer Bonding Integration Engineer. As a key...Knowledge in the use of Design of Experiments, statistical process control and analysis tools. * Strong understanding of… more
    Skyworks (08/14/24)
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  • Sr . Equipment Development Engineer…

    Micron Technology, Inc. (Boise, ID)
    …years of semiconductor process or equipment engineering experience, preferably in wafer bonding , plating, warpage control and packaging field Experience in ... of post probe and assembly process and equipment interactions. Experience in wafer bonding , plating, warpage control and packaging process development… more
    Micron Technology, Inc. (08/09/24)
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  • Sr . Packaging Engineer, Sensors (Avionics)

    SpaceX (Hawthorne, CA)
    …including one or more of the following: dicing, die-attach, pick-and-place, flip-chip, wire bonding , wafer bonding , encapsulation, or vacuum sealing + ... Sr . Packaging Engineer, Sensors (Avionics) at SpaceX Hawthorne,...+ Collaboratively identify and resolve manufacturing issues + Establish process monitors, pass/fail metrics, and implement process more
    SpaceX (07/24/24)
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  • Sr /Shift Technician - Semiconductor…

    Micron Technology, Inc. (Boise, ID)
    …handling, loading of lots, and system requests across CMP, WET, ETCH, PHOTO, CVD, bonding , debonding, TCD, wafer preparation, hybrid bonding , pre- and ... manufacturing processes and equipment, including CMP/ WET / ETCH/ PHOTO/ CVD/ bonding / debonding/ TCD/ wafer preparation/ hybrid bonding / encapsulation… more
    Micron Technology, Inc. (07/17/24)
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  • Sr . Manager, Engineering

    Skyworks (Newbury Park, CA)
    …is to improve FDC and SPC control for tighter control of equipment and process parameters. You will drive improvement in wafer cost, tool capacity, particles, ... Sr . Manager, Engineering Apply now " Date:Aug 29,...the world communicates. Requisition ID: 73186 Description As a Process Engineering Manager, you will direct, lead and manage… more
    Skyworks (09/03/24)
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  • Semiconductor Process Engineer,…

    Lockheed Martin (Goleta, CA)
    Process Engineer is responsible for sustaining/supporting III\-V and Si semiconductor wafer and packaging process areas, which may include photolithography, ... Santa Barbara Focalplane Infrared Sensors Business is seeking an experienced Semiconductor Process Engineer to join our team on\-site in Goleta, CA\. **What You… more
    Lockheed Martin (09/21/24)
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  • Senior Engineer, Manufacturing

    Abbott (Atlanta, GA)
    …microelectronics packaging concepts (eg wet wafer processes, physical vapor deposition, wafer bonding , wire bonding , encapsulation, etc.) + Experience ... life-saving product? At Abbott, our Heart Failure division is recruiting a Senior MEMS Process Development Engineer in Atlanta, GA, to develop and implement a… more
    Abbott (08/21/24)
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  • Senior MEMS Engineer

    Abbott (Atlanta, GA)
    …experience of advanced microelectronics packaging concepts (die-attach, pick-and-place, wire bonding , wafer bonding , adhesive micro-dispensing, etc.). ... Our 114,000 colleagues serve people in more than 160 countries. **Job Title** ** Senior MEMS Development Engineer** **Working at Abbott** At Abbott, you can do work… more
    Abbott (09/10/24)
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  • SMTS/Dmts, Advanced Packaging Architect - TPG

    Micron Technology, Inc. (Boise, ID)
    …WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures. + Experience with wafer bumping, wafer bonding , package assembly, substrate technology, ... and advance faster than ever. Micron Technology is searching for its next Senior Member of Technical Staff or Distinguished Member of Technical Staff! In this… more
    Micron Technology, Inc. (08/31/24)
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  • Product Engineer IV - (E4)

    Applied Materials (Santa Clara, CA)
    …+ Communicates complex ideas, anticipates potential objections and persuades others, often at senior levels, to adopt a different point of view + Passion for new ... materials, analysis methods + Coordinate with cross functional teams for design process , test, reliability and manufacturing to solve product and productivity issues… more
    Applied Materials (08/14/24)
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