• 3D IC Solutions Engineer - Package Design…

    Siemens Digital Industries Software (Wilsonville, OR)
    …and high performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering team in driving the development of ... that facilitate the architectural planning, physical design/verification, muti-die based electrical , thermal, mechanical stress analysis and manufacturing test of… more
    Siemens Digital Industries Software (08/25/24)
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  • Silicon Packaging Design Engineer

    Meta (Sunnyvale, CA)
    **Summary:** Meta is looking for an experienced Silicon Packaging design Engineer for its Ecosystem and Technical Operation team to support the development of custom ... of a world-class engineering team. **Required Skills:** Silicon Packaging Design Engineer Responsibilities: 1. Perform package design for advanced custom silicon… more
    Meta (08/21/24)
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  • Senior Microelectronics Hardware Design…

    Leidos (Arlington, VA)
    …Design Engineer to work with a multi-disciplined design team ( electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and ... Industrial Base's (DIB) access to trusted, state-of-the-art microelectronics. * Lead or support marketing and business development initiatives: develop technical… more
    Leidos (08/01/24)
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  • 3D Heterogenous Integration Engineer (2025…

    Global Foundries (Malta, NY)
    …to wafer hybrid bonding, die to wafer hybrid bonding, TSV/TOV and interposer development. Essential Responsibilities Include: + Lead 3DHI process development ... . Required Qualifications: + Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related… more
    Global Foundries (09/14/24)
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  • Senior Mixed-Signal ASIC Designer, Project Taara

    Google (Mountain View, CA)
    …Taara About the role: The Taara Project is seeking a Senior Integrated Circuit engineer leading the next generation circuit design as part of the R&D team developing ... cutting-edge wireless optical communication systems. The successful candidate will lead application specific integrated circuit (ASIC) development from concept to… more
    Google (09/19/24)
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