- Micron Technology, Inc. (Boise, ID)
- …team that is molding the future of technology! **Position Overview:** As an Advanced Packaging Engineer you will be primarily responsible for ... processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk...Engineering + Minimum of 5 years industry experience in Advanced Packaging As a world leader in… more
- Micron Technology, Inc. (Boise, ID)
- …to learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is ... leadership in the industry. **Position Overview:** We are seeking a Staff Design Engineer to join our TSV Packaging team. High-performance memory devices like… more
- Micron Technology, Inc. (Boise, ID)
- …Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging , you will be primarily responsible for ... to learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is… more
- Micron Technology, Inc. (Boise, ID)
- …Micron's **Technology Development experts** develop data driven and physics based Advanced Modeling and AI solutions to tackle complex challenges in semiconductor ... component, packaging , and systems engineering. The team plays a key...storage portfolio. **Responsibilities** + Drive the deployment of intelligent, advanced physics or ML-powered modeling solutions that enhance semiconductor… more
- Microsoft Corporation (Boise, ID)
- …system. + Drive future power and signal integrity solutions for chiplet architecture with advanced packaging and advanced silicon nodes + Design, model, and ... trends and landscape of technologies to drive development across Silicon-IP, Advanced packaging , Substrate technology, Board technology and Platform design… more
- Micron Technology, Inc. (Boise, ID)
- …inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is ... maintaining Micron's leadership in the industry. The Thermal Simulation Engineer will be directly involved in developing new and...to address all Thermal aspects of 2.5D and 3D advanced packaging development that are related to… more
- Micron Technology, Inc. (Boise, ID)
- …team that is molding the future of technology! **Position Overview:** As a Senior Process Engineer in the APTD team, you will be primarily responsible for ... for Micron products. You will grow into an expert engineer , driving roadmaps, which have a direct influence on...Defect analysis and data analysis. + Experience in semiconductor process engineering and packaging with fundamental understanding… more
- Micron Technology, Inc. (Boise, ID)
- …team that is molding the future of technology! **Position Overview:** As a Process Integration Engineer at Micron, you will define technology requirements, build ... program plans, and secure resources to drive process technology development programs. Your development focus will also...ensure rapid yield ramps of new technology nodes and packaging solutions. Expectations are to work independently and set… more
- Micron Technology, Inc. (Boise, ID)
- …to learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is ... summaries and make statistically based recommendations + Experience in semiconductor process engineering and packaging with fundamental understanding of incoming… more
- Ryder System (Boise, ID)
- …applying continuous improvement methods to support new and existing operations. The Engineer will identify and drive change within the operation through data driven ... and cost. Effectively leverage data analytics, engineering methodologies, and advanced lean tools to enable root cause identification and...across the operation. This position reports to the Lead Engineer , CI Manager or Sr. CI Manager and is… more
- Micron Technology, Inc. (Boise, ID)
- …evaluate signal integrity, power integrity, and reliability. + Develop and optimize advanced packaging solutions including FC-BGA, SiP, and 2.5D/3D IC ... in an outstanding role where you will build the future of semiconductor packaging technology. As a Semiconductor Package Simulation & Architecture Engineer , you… more
- Hoffman Construction Company (Boise, ID)
- …builder specializing in technically complex, sustainable projects across advanced technology, mission critical, life sciences, healthcare, higher education, ... OSM scopes involving 3D structural modules integrated with mechanical, plumbing, process , and electrical (MP&E) systems. The Lead Superintendent ensures safety,… more