• Principal Design Engineer , TSV…

    Micron Technology, Inc. (Boise, ID)
    …in the industry. **Position Overview:** We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance memory devices like ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    Micron Technology, Inc. (12/10/25)
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  • RF Packaging Engineer

    Eliassen Group (Boise, ID)
    **RF Packaging Engineer ** **Anywhere** **Type:** Contract **Category:** DevOps **Industry:** Technology **Workplace Type:** Remote **Reference ID:** JN ... that drives positive impact to join our team. The Packaging Engineer position will entail all aspects...+ Customer service oriented. + Ability to work with design teams to translate IC/system requirements input packaging more
    Eliassen Group (12/06/25)
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  • Sr Wet Process Engineer , Advanced…

    Micron Technology, Inc. (Boise, ID)
    …world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront ... driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information....leadership in the industry. As a Senior Wet Process Engineer , you will be primarily responsible for developing and… more
    Micron Technology, Inc. (12/09/25)
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  • Manager Solutions Design - Supply Chain…

    Ryder System (Boise, ID)
    …specializing in select design discipline (transportation, warehousing or network design ) or industry solutions (eg, packaging , inbound to manufacturing, ... here (http://ryder.com/job-applicant-privacy-policy) ._ **Job Description** : The Manager Solutions Design is responsible to support the growth of our Supply… more
    Ryder System (12/02/25)
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  • Senior Staff Engineer , Mechanical…

    Celestica (Boise, ID)
    …New Hampshire City: Remote Employee US **Summary** The Senior Staff Engineer , Mechanical Design develops new mechanical systems/modules and maintains ... mechanical system that they have designed. The Senior Staff Engineer , Mechanical Design works with cross functional...and technologies. + Guide RFQ and Celestica platform mechanical packaging solutions + Ability to rapidly develop and evaluate… more
    Celestica (11/01/25)
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  • Global Quality IC Package Design

    Micron Technology, Inc. (Boise, ID)
    …analysis, and continuous improvement. **Position Overview:** As a GQ Package Design /Development Quality Assurance (Pkg DDQA) Principal Engineer at Micron ... assessment and NUDD (New, Unique, Different, Difficult) analysis for new designs/ design rules and lead risk mitigation execution. + Develop holistic qualification… more
    Micron Technology, Inc. (12/18/25)
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  • Data Center Design Engineer - IC4

    Oracle (Boise, ID)
    …develops electronic parts, components, integrated circuitry, mechanical systems, equipment and packaging , and telecom system design . The successful candidate ... on the following key responsibilities: + Manage and create design of data center white space which includes rack...with colocation providers and internal stakeholders to deliver project design criteria and develop Basis of Design more
    Oracle (11/26/25)
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  • Principal Thermal Simulation Engineer

    Micron Technology, Inc. (Boise, ID)
    …customers to fully understand the product thermal risks and help optimize the packaging design by simulation support. + Work with internal/external vendors and ... leadership in the industry. **Position Overview:** The Thermal Simulation Engineer will be directly involved in developing new and...address all Thermal aspects of 2.5D and 3D advanced packaging development that are related to design ,… more
    Micron Technology, Inc. (12/10/25)
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  • Senior Software Engineer - Media Services

    Oracle (Boise, ID)
    …exceptions) + Nashville, TN + Austin, TX + Broomfield, CO As a Senior Software Engineer at Oracle Cloud Infrastructure, you play a role in the development of key ... OCI. These services include playback, content augmentation, video transcoding and packaging , content delivery, streaming analytics, and flexible billing & cost… more
    Oracle (11/25/25)
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  • Sr. Workforce Development Engineer , TPG

    Micron Technology, Inc. (Boise, ID)
    …to learn, communicate and advance faster than ever. **Workforce Development Engineer ** **Technology & Products Group (TPG)** **Location: Boise, ID or Richardson, ... Technology & Products (TPG) organization as a Workforce Development Engineer , where you will play a key role in...supporting the growth of our DRAM, HBM, and Advanced Packaging functions. **What You'll Do** As a Workforce Development… more
    Micron Technology, Inc. (10/17/25)
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  • Staff Process Engineer , APTD Bonding

    Micron Technology, Inc. (Boise, ID)
    …learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the ... driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information....leadership in the industry. **Position Overview:** As a Process Engineer on the APTD Bonding team, you will be… more
    Micron Technology, Inc. (12/10/25)
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  • Principal Process Engineer , APTD Bonding

    Micron Technology, Inc. (Boise, ID)
    …Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging , you will be primarily responsible for ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    Micron Technology, Inc. (11/12/25)
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  • Sr Principal Software Engineer

    Oracle (Boise, ID)
    …Seattle, WA * Optional: Redwood City, CA **Job Description** As a Senior Principal Engineer in this space, you will have broad ownership of core technical components ... OCI. These services include playback, content augmentation, video transcoding and packaging , content delivery, streaming analytics, and flexible billing & cost… more
    Oracle (11/25/25)
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  • Principal Signal Integrity Engineer

    Micron Technology, Inc. (Boise, ID)
    …multiple disciplines and organizations including Signal Integrity, Circuit and Chip Design , Packaging R&D and System Integration. Qualifications Successful ... communicate and advance faster than ever. **Principal** **Signal Integrity** ** Engineer ** **- Interface Pathfinding** Micron's Interface Pathfinding team serves as… more
    Micron Technology, Inc. (12/09/25)
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  • Senior Process Engineer , APTD

    Micron Technology, Inc. (Boise, ID)
    …learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the ... future of technology! **Position Overview:** As a Senior Process Engineer in the APTD team, you will be primarily...completed on time and on budget + Experience with design of experiment techniques (DOE), Statistical Process Control (SPC),… more
    Micron Technology, Inc. (12/06/25)
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  • Senior Principal Software Engineer

    Oracle (Boise, ID)
    …WA * Optional: Redwood City, CA **Job Description** As a Senior Principal Engineer in Oracle Cloud Infrastructure, you will provide key technical guidance and ... to the cloud. The charter is responsibility for research, design , implementation and operation of a new set of...and game development studios is highly desired. Senior Principal Engineer is an individual contributor role that is among… more
    Oracle (11/25/25)
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  • Principal Software Engineer , OCI Media…

    Oracle (Boise, ID)
    …OCI hubs: Austin, TX, Nashville, TN or Broomfield, CO As a Principal Engineer in Oracle Cloud Infrastructure, you will have the opportunity solve challenging ... enable delivery of novel consumer video applications. The charter is responsibility for design , implementation and operation of a new set of cloud services focused… more
    Oracle (11/25/25)
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  • Senior Optical Engineer

    Oracle (Boise, ID)
    …logical design of printed circuit boards or integrated circuits; mechanical design of electronics enclosures or integrated circuit packaging ; and embedded ... **Job Description** The Senior Optical Engineer will be joining the Optical Network Engineering...needs. Serve as a technical lead on network automation design and delivery projects. Comprehensive understanding of the software… more
    Oracle (12/20/25)
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  • Senior Software Engineer - Media…

    Oracle (Boise, ID)
    …Nashville, TN 2. Austin, TX 3. Broomfield, CO As a Senior Software Engineer in Oracle Cloud Infrastructure, you will have the opportunity solve challenging technical ... novel consumer video applications. The charter is responsibility for design , implementation and operation of a new set of...and game development studios is a plus. Senior Software Engineer is an individual contributor role that requires a… more
    Oracle (12/22/25)
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  • Staff Signal Integrity Engineer

    Micron Technology, Inc. (Boise, ID)
    …subject areas and organizations (eg, Signal Integrity, Circuit and Chip Design , Packaging R&D and System Integration)! **Responsibilities:** + Development ... of future improvement in performance scaling, signaling, and sophisticated packaging + Leverage modeling and simulation methodology to improve accuracy to signal… more
    Micron Technology, Inc. (11/20/25)
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