- Micron Technology, Inc. (Boise, ID)
- …in the industry. **Position Overview:** We are seeking a Staff Design Engineer to join our TSV Packaging team. High-performance memory devices like HBM, ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …customers to fully understand the product thermal risks and help optimize the packaging design by simulation support. + Work with internal/external vendors and ... maintaining Micron's leadership in the industry. The Thermal Simulation Engineer will be directly involved in developing new and...address all Thermal aspects of 2.5D and 3D advanced packaging development that are related to design ,… more
- Micron Technology, Inc. (Boise, ID)
- …to learn, communicate and advance faster than ever. **Workforce Development Engineer ** **Technology & Products Group (TPG)** **Location: Boise, ID or Richardson, ... Technology & Products (TPG) organization as a Workforce Development Engineer , where you will play a key role in...supporting the growth of our DRAM, HBM, and Advanced Packaging functions. **What You'll Do** As a Workforce Development… more
- Micron Technology, Inc. (Boise, ID)
- …world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront ... of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated… more
- Micron Technology, Inc. (Boise, ID)
- …learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the ... of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is… more
- Micron Technology, Inc. (Boise, ID)
- …Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging , you will be primarily responsible for ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …Modeling and AI solutions to tackle complex challenges in semiconductor component, packaging , and systems engineering. The team plays a key role in predictive ... solutions that enhance semiconductor process technology development, package development, design , and early manufacturing workflows-leveraging large-scale, unstructured and often… more
- Micron Technology, Inc. (Boise, ID)
- …in an outstanding role where you will build the future of semiconductor packaging technology. As a Semiconductor Package Simulation & Architecture Engineer , you ... is developed for a highly skilled professional with deep expertise in packaging , thermal/mechanical & electrical simulation along with product architecture. You will… more
- SHI (Boise, ID)
- …- in our offices or yours.** **Job Summary** The Senior Managed Services Engineer is responsible for supporting a designated set of technologies at an advanced ... to a global knowledge base, ensuring effective incident management. + Design and validate technical solutions, supporting network and infrastructure development. +… more
- Micron Technology, Inc. (Boise, ID)
- …is molding the future of technology! **Position Overview:** As a Senior Process Engineer in the APTD team, you will be primarily responsible for optimizing ... for Micron products. You will grow into an expert engineer , driving roadmaps, which have a direct influence on...completed on time and on budget. + Experience with design of experiment techniques (DOE), Statistical Process Control (SPC),… more
- Micron Technology, Inc. (Boise, ID)
- …molding the future of technology! **Position Overview:** As a Process Integration Engineer at Micron, you will define technology requirements, build program plans, ... with manufacturing to ensure rapid yield ramps of new technology nodes and packaging solutions. Expectations are to work independently and set direction with the… more
- Hoffman Construction Company (Boise, ID)
- …assist with RFIs and submittal reviews (in coordination with the OSM Project Engineer /Construction Manager). + Oversee QA/QC program for all OSM elements prior to ... shipment and installation. + Resolve design and constructability issues in collaboration with project stakeholders....responsibility levels (LOD 1-3) for OSM scopes. + Oversee packaging , labeling, and logistics to ensure efficient delivery and… more
