- Celestica (Boise, ID)
- …New Hampshire City: Remote Employee US **Summary** The Senior Staff Engineer , Mechanical Design develops new mechanical systems/modules and maintains ... mechanical system that they have designed. The Senior Staff Engineer , Mechanical Design works with cross functional...and technologies. + Guide RFQ and Celestica platform mechanical packaging solutions + Ability to rapidly develop and evaluate… more
- Micron Technology, Inc. (Boise, ID)
- …to learn, communicate and advance faster than ever. **Workforce Development Engineer ** **Technology & Products Group (TPG)** **Location: Boise, ID or Richardson, ... Technology & Products (TPG) organization as a Workforce Development Engineer , where you will play a key role in...supporting the growth of our DRAM, HBM, and Advanced Packaging functions. **What You'll Do** As a Workforce Development… more
- Micron Technology, Inc. (Boise, ID)
- …Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging , you will be primarily responsible for ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Ensono (Boise, ID)
- Senior Backup Engineer - Cyber Vault & Data ProtectionRemote - United StatesJR012522 At Ensono, our **Purpose is to be a relentless ally, disrupting the status quo ... area._ We are seeking a seasoned L3 Cyber Vault Administrator to design , operate, and continuously improve our cyber-resilient backup and recovery platforms. You… more
- Micron Technology, Inc. (Boise, ID)
- …subject areas and organizations (eg, Signal Integrity, Circuit and Chip Design , Packaging R&D and System Integration)! **Responsibilities:** + Development ... of future improvement in performance scaling, signaling, and sophisticated packaging + Leverage modeling and simulation methodology to improve accuracy to signal… more
- SHI (Boise, ID)
- …- in our offices or yours.** **Job Summary** The Senior Managed Services Engineer is responsible for supporting a designated set of technologies at an advanced ... to a global knowledge base, ensuring effective incident management. + Design and validate technical solutions, supporting network and infrastructure development. +… more
- Micron Technology, Inc. (Boise, ID)
- …molding the future of technology! **Position Overview:** As a Process Integration Engineer at Micron, you will define technology requirements, build program plans, ... with manufacturing to ensure rapid yield ramps of new technology nodes and packaging solutions. Expectations are to work independently and set direction with the… more
- Micron Technology, Inc. (Boise, ID)
- …Modeling and AI solutions to tackle complex challenges in semiconductor component, packaging , and systems engineering. The team plays a key role in predictive ... solutions that enhance semiconductor process technology development, package development, design , and early manufacturing workflows-leveraging large-scale, unstructured and often… more
- Ryder System (Boise, ID)
- …specializing in select design discipline (transportation, warehousing or network design ) or industry solutions (eg, packaging , inbound to manufacturing, ... here (http://ryder.com/job-applicant-privacy-policy) ._ **Job Description** : The Manager Solutions Design is responsible to support the growth of our Supply… more
- Micron Technology, Inc. (Boise, ID)
- … packaging technologies such as TSV, stacked packaging , and 3D packaging . + Experience with custom SoC/ASIC design and HW/SW co-optimization. + ... to learn, communicate and advance faster than ever. As a CMBU Systems Architecture Engineer at Micron Technology, you will have the opportunity to establish a deep… more
- Hoffman Construction Company (Boise, ID)
- …assist with RFIs and submittal reviews (in coordination with the OSM Project Engineer /Construction Manager). + Oversee QA/QC program for all OSM elements prior to ... shipment and installation. + Resolve design and constructability issues in collaboration with project stakeholders....responsibility levels (LOD 1-3) for OSM scopes. + Oversee packaging , labeling, and logistics to ensure efficient delivery and… more
- PagerDuty (Boise, ID)
- …optimization initiatives. You will collaborate closely with product, engineering, design , pricing, and go-to-market teams to transform PagerDuty's value realization ... growth mindset and experimentation practices + Collaborate with pricing team on packaging strategies that drive user adoption during consumption model transition +… more