- Amazon (San Diego, CA)
- …experience in pre-production development and manufacture of semiconductor integrated circuit (IC) chips for digital and analog ASICs and SOCs. ASICs are the ... manufacturing flows/dependencies/cycle-times from post-GDSII tape-out through wafer foundry, package substrate fabrication, into OSAT contract manufacturing applying module technologies… more
- Google (Mountain View, CA)
- …+ 6 years of experience in people management. + Experience in packaging and substrate technology (eg, Flip Chip Chip Scale Package (FCCSP), Package ... delivering unparalleled performance, efficiency, and integration. As a Packaging Development Manager , you will lead our mobile silicon packaging efforts. You will… more