- Micron Technology, Inc. (Boise, ID)
- …devices. Areas of concentration will include integration and circuit issues specific to 3D DRAM technology. In addition to a broad basis of process ... to:** + Lead technology integration activities to enable state-of-the-art 3D DRAM , working on device components such as charge storage devices and thin-film… more
- Micron Technology, Inc. (Boise, ID)
- …the world to learn, communicate and advance faster than ever. As a Process Integration engineer in the 3D DRAM organization, you will be part of a team ... include integration and circuit issues specific to 3D DRAM technology. In addition to a... integration activities in enabling manufacturability of state-of-the-art 3D DRAM technology, working on device components… more
- Micron Technology, Inc. (Boise, ID)
- …team chartered to develop 3D DRAM technology at Micron! As a Process Integration Engineer in the 3D DRAM and Emerging Memory Organization, you ... include Integration and Circuit issues specific to 3D DRAM technology. In addition to a... Integration activities in enabling manufacturability of innovative 3D DRAM technology, working on device components… more
- Micron Technology, Inc. (Boise, ID)
- …or Senior Member of Technical Staff (SMTS), you will be part of a groundbreaking 3D DRAM research and development Wet Process team! We evaluate new hardware ... to develop processes that meet device requirements for future 3D DRAM technology nodes; transfer processes to...engineer in aR&D environment preferred + Experience in DRAM or Memory is preferred. As a world leader… more
- Micron Technology, Inc. (Boise, ID)
- …Memory DRAM solutions! Additionally, implementation of innovative 2.5D and 3D solutions, including HBM, from an electrical and packaging standpoint. Product ... abilities **In our hybrid role,** as a PE Pathfinding Engineer on the High Bandwidth Memory (HBM) technology team,...company's charter to be the most cost-effective producer of DRAM memory. In HBM DEG (High Bandwidth Memory, … more