- Qualcomm (San Diego, CA)
- …+ Experience with 2.5D and 3D STCO and pathfinding + Familiarity with heterogeneous integration processes such as hybrid bonding, wafer bonding, TSV, backside ... help create a smarter, connected future for all. As a Qualcomm ASIC Engineer , you will define, model, design (digital and/or analog), optimize, verify, validate,… more