• IC Packaging Principal

    Cadence Design Systems, Inc. (San Jose, CA)
    …of the Cadence tool set in the context of multiple flows including IC Packaging , high speed design, signal integrity and electrical constraints definition. ... Design experience and industry knowledge of current IC Packaging Design and manufacturing processes is required. Knowledge of advanced IC packaging flows… more
    Cadence Design Systems, Inc. (06/08/25)
    - Save Job - Related Jobs - Block Source
  • Principal Engineer, Packaging

    SanDisk (Milpitas, CA)
    …computational and/or experimental solid mechanics, is required. In-depth knowledge of IC packaging is highly desired. **Qualifications** REQUIRED: + Ph.D. ... academic coursework or experience required in mechanical engineering of IC packaging and related areas. + Strong...applying. Based on our experience, we anticipate that the application deadline will be **08/01/2025** (3 months from posting),… more
    SanDisk (05/02/25)
    - Save Job - Related Jobs - Block Source
  • Principal Engineer, Packaging

    SanDisk (Milpitas, CA)
    …through academic coursework or experience required in thermal modeling and measurements of IC packaging and related areas. + A strong background in thermal ... our world moving forward. **Job Description** ESSENTIAL DUTIES AND RESPONSIBILITIES: + As a Packaging Engineer, you will work in the Packaging R&D group on… more
    SanDisk (05/31/25)
    - Save Job - Related Jobs - Block Source