• 3D Advanced Heterogeneous

    Global Foundries (Malta, NY)
    …to network with executives. Summary of Role: Intern engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes ... verbal communication skills + Strong planning & organizational skills + Any Advanced Semiconductor Packaging or Semiconductor Integration experience a big plus… more
    Global Foundries (11/08/25)
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  • 3D Heterogeneous Integration

    Global Foundries (Malta, NY)
    …state-of-the-art 300mm fabrication facility in Malta, New York . This role will entail 3D heterogeneous integration (3DHI) design enablement to enable our ... etc.) that must be followed for an integrated circuit (IC) design to be manufacturable. + Advanced packaging liaison to the DM and PDK ( Process D esign K it) teams… more
    Global Foundries (11/09/25)
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  • Dicing Specialist, Silicon Assembly (Starlink)

    SpaceX (Bastrop, TX)
    …high-volume setting + Experience with advanced dicing for heterogeneous integration , such as chiplets or 3D stacking, or handling ultra-thin wafers + ... In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and… more
    SpaceX (10/22/25)
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  • Member of Technical Staff (MTS) - Advanced

    Global Foundries (Malta, NY)
    …continuing to develop solutions for differentiated technology. Enabling Silicon Photonics advanced packaging as it strives to offer heterogeneous solutions ... www.gf.com. Summary of Role: GLOBALFOUNDRIES is seeking a MTS engineer for its Advanced Silicon Photonics Packaging Technology Development team. In our advanced more
    Global Foundries (09/01/25)
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  • Research Engineer II

    Texas A&M University System (College Station, TX)
    …tools. + Working knowledge of chemical mechanical polishing, flip-chip bonding, and 2.5D/ 3D heterogeneous integration . + Ability to operate independently ... lithography, photolithography, thin film deposition (electroplating, PVD, CVD, and ALD), 3D printing, wafer bonding, reactive ion etching (ICP-RIE and DRIE),… more
    Texas A&M University System (09/24/25)
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