- Micron Technology, Inc. (Boise, ID)
- …the world to learn, communicate and advance faster than ever. As a Process Integration engineer in the 3D DRAM organization, you will be part of a team ... include integration and circuit issues specific to 3D DRAM technology. In addition to a... integration activities in enabling manufacturability of state-of-the-art 3D DRAM technology, working on device components… more
- Micron Technology, Inc. (Boise, ID)
- …or Senior Member of Technical Staff (SMTS), you will be part of a groundbreaking 3D DRAM research and development Wet Process team! We evaluate new hardware ... to develop processes that meet device requirements for future 3D DRAM technology nodes; transfer processes to...engineer in aR&D environment preferred + Experience in DRAM or Memory is preferred. As a world leader… more
- Micron Technology, Inc. (Folsom, CA)
- …circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and ... advanced CMOS technology qualification and mass production ramp-up. + Collaborating with integration , module & 3D packaging teams (internal and external) to… more
- Micron Technology, Inc. (Allen, TX)
- …how the world uses information to enrich life. As an HBM Memory Lead Design Engineer in our DRAM and Emerging Memory Group (DEG), you will be responsible ... to develop memory products. This includes simulating, optimizing, and floor planning DRAM circuits. In this position, you will collaborate with Micron's various… more
- Micron Technology, Inc. (Atlanta, GA)
- …circuit design, memory subsystem operation, high-performance computing architectures a,nd 2.5D & 3D package integration to understand and analyze bottlenecks and ... and advance faster than ever. As an HBM Design Engineer , you will be responsible for the design &...responsible for the design & development of next-generation HBM DRAM products. You will be part of a highly… more
- Micron Technology, Inc. (Boise, ID)
- …Memory DRAM solutions! Additionally, implementation of innovative 2.5D and 3D solutions, including HBM, from an electrical and packaging standpoint. Product ... abilities **In our hybrid role,** as a PE Pathfinding Engineer on the High Bandwidth Memory (HBM) technology team,...company's charter to be the most cost-effective producer of DRAM memory. In HBM DEG (High Bandwidth Memory, … more
- Micron Technology, Inc. (Allen, TX)
- …circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and ... of experience and education. In HBM DEG (High Bandwidth Memory - DRAM Engineering Group), we innovate and integrate end-to-end groundbreaking front-end and backend… more