- Cadence Design Systems, Inc. (San Jose, CA)
- …be responsible for guiding the design implementation solutions and flow development of 3DIC for various top semiconductor companies of the world. They will interact ... + Physical Implementation: The person will be responsible to support 3DIC design partitioning, floor planning, IP placement, TSV placement and power-grid… more
- Micron Technology, Inc. (Boise, ID)
- …molding the future of technology! **Position Overview:** As a Process Integration Engineer at Micron, you will define technology requirements, build program plans, ... and timely decisions. You will need to advise and lead the work of others and ensure good communication,...Advanced Package Integration and DRAM, NAND or other memory. ( 3DIC , FO, Hybrid bond etc.) + Excellent data extraction,… more