• Die Attach & Wire Bond

    Micross Components (Apopka, FL)
    Summary: Perform duties to attach die to packages, set up and program wire bond machines, and wire bond die to packages according to build ... involving the making of minor decisions. Must have strong wire bond experience with an understanding of...temperature for specjfic epoxy being used. Cure epoxy. + Attach die to package per build print.… more
    Micross Components (04/18/24)
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  • Die Bond / Wire Bond

    Mercury Systems (Phoenix, AZ)
    …and routine electronic assembly operations on components or subassemblies * Technical Knowledge of Die attach , Wire bond , Epoxy Dispense, Flipchip, Wafer ... K&S ICONN Wire bonders, Dage and West Bond wire pull equipment. In addition, you...set up and run Besi Datacon 2200 and Micron Die Attach machines, Topaz Chip Shooter, Asymtek… more
    Mercury Systems (03/19/24)
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  • Assembly Operator

    Micross Components (Milpitas, CA)
    …assembly tasks under microscope eight hours a day + Perform 2nd and 3rd optical visual inspection, die attach , wire bond , stud pull, wire dressing, ... for high reliability and state-of-the-are electronics, Micross' solutions range from bare die and wafer processing to advanced and custom packaging to component… more
    Micross Components (05/07/24)
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  • Solder Assembler

    Mercury Systems (Oxnard, CA)
    …Knowledge and experience in two or more of the following areas is required; board mount, die attach , wire bond , soldering, or basic mechanical assembly * ... Other Microelectronic Certificates such as IPC-A-610 or J-STD-001 * Ability to multi-task * Ability to work with general instruction on daily activities Full-Time Equivalent Annual Salary Range: $32,240 - $48,000 for a Non-Technical Int Specialist at Oxnard CA… more
    Mercury Systems (05/18/24)
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  • AssocOprtns Semi-Conductor Ld

    Honeywell (Richardson, TX)
    …Run multiple component assembly tools including laser scribe, solder flow, die attach (pick& place), wire bond , epoxy encapsulation & test Support ... the engineering team with process/tool trouble shotting and optimization tasks Understanding Dimensional Measurement Requirements Tool Qualification & Process Capability Must be able to do use a microscope to perform monitoring inspection of in process… more
    Honeywell (05/02/24)
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  • Process Engineer

    Micross Components (Apopka, FL)
    …standards a plus. + Knowledge of Mil-STD-883 / Mil-STD-750 in test methods with related equipment ( wire bond , die attach , & furnace) a plus. + Knowledge ... or experience with Automatic assembly equipment for Wire bond , Die attach a plus + Knowledge in semiconductor manufacturing a plus. + Self-motivated with… more
    Micross Components (05/07/24)
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  • Microelectronics Specialist

    SpaceX (Redmond, WA)
    …Experience with meeting die attach quality requirements, including coverage, die shear and bond line thickness requirements per Mil-Std-883 + Experience ... + Program, load, and operate automated equipment such as; die attach , wirebonder, plasma cleaner and AOI. +...with wire pull machines for wire bond more
    SpaceX (05/24/24)
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  • Assembler, Electro Mech

    Teledyne (Hawthorne, CA)
    …+ May perform a wide variety of other assembly operations such as touch-up, hand solder, die attach , substrate attach and clip attach as assigned once ... Setup and operate automatic and/or manual bonding machines that bond gold and aluminum wire to integrated...variety of other related equipment, including high-powered microscopes, Dage wire pull and die shear equipment with… more
    Teledyne (05/07/24)
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  • Manufacturing Assembler

    Teledyne (Mountain View, CA)
    …assembly tools and materials to perform a wide variety of assembly operations such as wire bonding, die attach , substrate attach and board installation. ... amplifiers + Build flatpack amplifiers using conductive epoxy + Die attach silicon and GaAs FET components...GaAs FET components to thin-film alumina substrates + Perform bond pull and keep accurate records in the … more
    Teledyne (05/16/24)
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  • Laser Module Packaging Engineer (Boston…

    Lightmatter (Mountain View, CA)
    …edge attach (butt coupling), die to lens attach , and fiber attach processes, and wire bond . + Excellent verbal and written communication skills ... to effectively collaborate with cross-functional teams and present findings to stakeholders. + Exposure to quality and reliability requirements for optical components. Benefits + Comprehensive Health Care Plan (Medical, Dental & Vision) + 401k matching + Life… more
    Lightmatter (04/13/24)
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