- BAE Systems (Cedar Rapids, IA)
- …may be available based on position level and/or job specifics. ** Microelectronics Packaging Engineer - ( Hybrid )** **116436BR** EEO Career Site Equal ... independent work, it will take the form of a hybrid work format, with time split between working onsite...or Materials Engineering to join our team as a Microelectronics Packaging Design Engineer . As… more
- BAE Systems (Cedar Rapids, IA)
- …on position level and/or job specifics. **Senior Mechanical Engineer - Microelectronics Packaging ( Hybrid )** **114793BR** EEO Career Site Equal ... independent work, it will take the form of a hybrid work format, with time split between working onsite...and the desire to work in the world of Microelectronics Packaging Design. Our team needs engineers… more
- BAE Systems (Cedar Rapids, IA)
- **Job Description** Job Description: Join our team at BAE Systems as a Microelectronics Packaging Design Engineer intern and work on cutting-edge projects ... that shape the future of aerospace and defense. Our hybrid work format allows for a balance of collaborative...the industry's most difficult problems. Internship Summary: As a Microelectronics Packaging Design Engineer intern,… more
- Johns Hopkins Applied Physics Laboratory (Laurel, MD)
- …frontiers of space. This is a unique opportunity to apply a passion for microelectronics packaging toward advanced prototypes and one-of-a kind systems that will ... other engineers, technicians, and supervisor. + Work with the Microelectronics Assembly Engineer to solve or diagnose...or diagnose problems with processes or packages. + Hands-on microelectronics and hybrid assembly work, especially with… more
- RTX Corporation (Atlanta, GA)
- …enable future generation technologies across RTX. This role will work closely with the Microelectronics Packaging and Design teams in El Segundo, CA. This role ... world. The Raytheon Effector Sub-System Products Department is currently seeking an Electrical Engineer to serve in the role of **Senior Electrical Engineer **… more
- BOOZ, ALLEN & HAMILTON, INC. (Lexington Park, MD)
- FPGA Engineer , Mid Key Role: Support major microelectronics programs in the areas of design, verification, fabrication, packaging , te chn ology node access, ... the design, development, test, fielding, and sustainment of advanced microelectronics systems and asso cia ted t rus t...+ If this position is listed as remote or hybrid , you'll periodically work from a Booz Allen or… more
- Stanley Black and Decker (Towson, MD)
- …you'll be part of our Tools & Outdoor team and will be working as a hybrid employee. The Lead Electro-Mechanical Engineer will be a key contributor to the ... Lead Electro-Mechanical Engineer Towson, MD **Come build something that matters.**...low-volume production demands. + Design and implement robust electro-mechanical packaging and charging solutions for outdoor environments. + Manage… more
- RTX Corporation (Andover, MA)
- …Engineer_** to join our Module Development Section with the Advanced Microelectronics Solutions (AMS) Department as a technical lead. The AMS department ... teams and/or projects + Experience in module/sub-system assembly & packaging process + Experience in thermal modeling and analysis....regardless of whether the role is designated as on-site, hybrid or remote._** The salary range for this role… more