- Micron Technology, Inc. (Boise, ID)
- …fundamental understanding of bond process and equipment interactions. + Experience in wafer bonding process development and understanding of bonding ... Process and Equipment Development Engineer in the NAND wafer bonding R&D team, you will be...technical fields. + 3 to 5 years of semiconductor process engineering experience in wafer bonding… more
- Skyworks (Irvine, CA)
- Sr Principal, Wafer Bonding ...Process experts, Operations, and suppliers as well. The Wafer Bonding Integration Engineer will be part ... Description Skyworks is seeking a highly skilled and experienced Wafer Bonding Integration Engineer. As a key...Knowledge in the use of Design of Experiments, statistical process control and analysis tools. * Strong understanding of… more
- Micron Technology, Inc. (Boise, ID)
- …front of line, middle of line, interconnect of DRAM modules. + Experience of process integration with wafer bonding technology. + Device Physics, Electronics ... learn, communicate and advance faster than ever. As a Sr . or Principal DRAM Process Integration Pathfinding Engineer within the Technology Development group at… more
- Micron Technology, Inc. (Boise, ID)
- …programs. More specifically, you will develop sophisticated interconnect technology solutions that include wafer to wafer bonding , using Hybrid Bonding , ... a strong work ethic and integrity to join our Wafer Level Packaging Technologies Team in Boise, Idaho. As...or Fusion bonding . You will integrate process flows that involve thinning of wafers and through… more
- L3Harris (Mason, OH)
- Job Title: Sr . Associate, Manufacturing Engineer (Semiconductor Process Engineer-Wirebond/Assembly) Job Code: 10956 Job Location: Mason, OH Schedule: 9/80; every ... a Semiconductor Process Engineer, you will support a variety of wafer /die fabrication tools and processes, perform data analysis for development and production… more
- SpaceX (Hawthorne, CA)
- …including one or more of the following: dicing, die-attach, pick-and-place, flip-chip, wire bonding , wafer bonding , encapsulation, or vacuum sealing + ... Sr . Packaging Engineer, Sensors (Avionics) at SpaceX Hawthorne,...+ Collaboratively identify and resolve manufacturing issues + Establish process monitors, pass/fail metrics, and implement process … more
- Micron Technology, Inc. (Boise, ID)
- …handling, loading of lots, and system requests across CMP, WET, ETCH, PHOTO, CVD, bonding , debonding, TCD, wafer preparation, hybrid bonding , pre- and ... manufacturing processes and equipment, including CMP/ WET / ETCH/ PHOTO/ CVD/ bonding / debonding/ TCD/ wafer preparation/ hybrid bonding / encapsulation… more
- SpaceX (Bastrop, TX)
- Sr . IC Packaging Engineer, Silicon Technology (Starlink) at SpaceX Bastrop, TX SpaceX was founded under the belief that a future where humanity is out exploring the ... this possible, with the ultimate goal of enabling human life on Mars. SR . IC PACKAGING ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its experience in… more
- Micron Technology, Inc. (Boise, ID)
- …semiconductor packaging or frontend equipment such as CMP, WET, ETCH, PHOTO, CVD, bonding , debonding, TCD, wafer preparation, hybrid bonding , and ... communicate and advance faster than ever. **Job Responsibilities** : - ** Process Operation** : Monitor and control semiconductor packaging processes across various… more
- Abbott (Atlanta, GA)
- …acid cleans, Wet and Dry etch, PVD and sputtering metal deposition, Photolithography, wire- bonding equipment and processes. + Wafer alignment and bonding , ... Our 114,000 colleagues serve people in more than 160 countries. **Job Title** ** Senior Manufacturing Engineer** **Working at Abbott** At Abbott, you can do work that… more
- Abbott (Atlanta, GA)
- …hands-on experience of advanced microelectronics packaging concepts (die-attach, pick-and-place, wire bonding , flip-chip, wafer bonding , encapsulation, etc.) ... life-saving product? At Abbott, our Heart Failure division is recruiting a ** Senior MEMS Development Engineer** in Atlanta, GA, to drive the future roadmap… more
- Micron Technology, Inc. (Boise, ID)
- …WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures. + Experience with wafer bumping, wafer bonding , package assembly, substrate technology, ... inspiring the world to learn, communicate and advance faster than ever. As an Senior Member of Technical Staff or Distinguished Member of Technical Staff in Advanced… more
- Micron Technology, Inc. (Folsom, CA)
- …collaborating closely with a global team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to execute to a common ... strategic and technical leadership across the semiconductor industry involving wafer foundries and fabless design houses. + Drive STCO/DTCO… more