- Micron Technology, Inc. (Boise, ID)
- …devices. Areas of concentration will include integration and circuit issues specific to 3D DRAM technology. In addition to a broad basis of process ... to:** + Lead technology integration activities to enable state-of-the-art 3D DRAM , working on device components such as charge storage devices and thin-film… more
- Micron Technology, Inc. (Boise, ID)
- …the world to learn, communicate and advance faster than ever. As a Process Integration engineer in the 3D DRAM organization, you will be part of a team ... include integration and circuit issues specific to 3D DRAM technology. In addition to a... integration activities in enabling manufacturability of state-of-the-art 3D DRAM technology, working on device components… more
- Micron Technology, Inc. (Boise, ID)
- …team chartered to develop 3D DRAM technology at Micron! As a Process Integration Engineer in the 3D DRAM and Emerging Memory Organization, you ... include Integration and Circuit issues specific to 3D DRAM technology. In addition to a... Integration activities in enabling manufacturability of innovative 3D DRAM technology, working on device components… more
- Micron Technology, Inc. (Boise, ID)
- …or Senior Member of Technical Staff (SMTS), you will be part of a groundbreaking 3D DRAM research and development Wet Process team! We evaluate new hardware ... to develop processes that meet device requirements for future 3D DRAM technology nodes; transfer processes to...engineer in aR&D environment preferred + Experience in DRAM or Memory is preferred. As a world leader… more
- Micron Technology, Inc. (Allen, TX)
- …circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and ... of experience and education. In HBM DEG (High Bandwidth Memory - DRAM Engineering Group), we innovate and integrate end-to-end groundbreaking front-end and backend… more
- Micron Technology, Inc. (Boise, ID)
- …+ Lead technology integration activities in enabling manufacturability of state-of-the-art 3D DRAM technology, working on device components such as charge ... storage devices and thin-film transistors (TFTs), among others. + Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to yield and margin… more
- Micron Technology, Inc. (Boise, ID)
- …doing so can fuel the very innovation we are pursuing. As a Process Integration Engineer Intern in the Advanced DRAM organization, you will be part of a team ... include Integration and Circuit issues specific to 3D DRAM technology. In addition to a... integration activities in enabling manufacturability of state-of-the-art 3D DRAM technology, working on device components… more
- Micron Technology, Inc. (Folsom, CA)
- …circuit design, memory subsystem operation, high-performance computing architectures and 2.5D & 3D package integration to understand and analyze bottlenecks and ... advanced CMOS technology qualification and mass production ramp-up. + Collaborating with integration , module & 3D packaging team (internal and external) to… more
- Micron Technology, Inc. (Folsom, CA)
- …circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and ... advanced CMOS technology qualification and mass production ramp-up. + Collaborating with integration , module & 3D packaging teams (internal and external) to… more
- Micron Technology, Inc. (Allen, TX)
- …how the world uses information to enrich life. As an HBM Memory Lead Design Engineer in our DRAM and Emerging Memory Group (DEG), you will be responsible ... to develop memory products. This includes simulating, optimizing, and floor planning DRAM circuits. In this position, you will collaborate with Micron's various… more
- Micron Technology, Inc. (Atlanta, GA)
- …circuit design, memory subsystem operation, high-performance computing architectures and 2.5D & 3D package integration to understand and analyze bottlenecks and ... and advance faster than ever. As an HBM Design Engineer , you will be responsible for the design &...for the design & development of next generation HBM DRAM products. You will be part of a highly… more
- Micron Technology, Inc. (Folsom, CA)
- …circuit design, memory subsystem operation, high-performance computing architectures and 2.5D & 3D package integration to understand and analyze bottlenecks and ... for the design & development of next generation HBM DRAM products. You will be part of a highly...delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies + Good verbal and written communication… more
- Micron Technology, Inc. (Boise, ID)
- …Memory DRAM solutions! Additionally, implementation of innovative 2.5D and 3D solutions, including HBM, from an electrical and packaging standpoint. Product ... abilities **In our hybrid role,** as a PE Pathfinding Engineer on the High Bandwidth Memory (HBM) technology team,...company's charter to be the most cost-effective producer of DRAM memory. In HBM DEG (High Bandwidth Memory, … more
- Micron Technology, Inc. (Boise, ID)
- …films, scatterometry /ellipsometry, , CDSEM, or FIB metrology applications on next-generation 3D NAND/ DRAM processes within Fab 4 and qualification for ... (photolithography overlay/registration, ellipsometry, scatterometry, etc) and its application to 3D NAND/ DRAM metrology cases. + Process and equipment-related… more
- Micron Technology, Inc. (Boise, ID)
- …learn, communicate and advance faster than ever. As a wafer bonding process engineer within our DRAM Technology Development organization at Micron Technology, ... Wafer bonding process development and equipment related experience required + Prior integration experience of 3D TSV, micro-bumps, temporary bonding/ debonding,… more