• Die Bond / Wire Bond

    Mercury Systems (Phoenix, AZ)
    …and routine electronic assembly operations on components or subassemblies * Technical Knowledge of Die attach, Wire bond , Epoxy Dispense, Flipchip, Wafer ... K&S ICONN Wire bonders, Dage and West Bond wire pull equipment. In addition, you...set up and run Besi Datacon 2200 and Micron Die Attach machines, Topaz Chip Shooter, Asymtek epoxy dispense,… more
    Mercury Systems (03/19/24)
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