• Die Bond / Wire Bond

    Mercury Systems (Phoenix, AZ)
    …and routine electronic assembly operations on components or subassemblies * Technical Knowledge of Die attach, Wire bond , Epoxy Dispense, Flipchip, Wafer ... K&S ICONN Wire bonders, Dage and West Bond wire pull equipment. In addition, you...set up and run Besi Datacon 2200 and Micron Die Attach machines, Topaz Chip Shooter, Asymtek epoxy dispense,… more
    Mercury Systems (03/19/24)
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  • Die Attach & Wire Bond

    Micross Components (Apopka, FL)
    …to packages, set up and program wire bond machines, and wire bond die to packages according to build prints, complying with instructions and ... involving the making of minor decisions. Must have strong wire bond experience with an understanding of...for specjfic epoxy being used. Cure epoxy. + Attach die to package per build print. + Plasma clean… more
    Micross Components (04/18/24)
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  • Microelectronics Operator/Orlando, FL/4x10…

    Lockheed Martin (Orlando, FL)
    …semi\-automatic and automatic or probe\-set bench set up\. 3\.\) Operates and adjusts semi conductor die bond machine to bond die into packages per ... of microscope and micro manipulators for precise control of die placement\. 4\.\) Test silicon wafers using semi\-automatic wafer...test fixtures and automatic handlers 6\.\) Operates and adjusts wire bond apparatus to bond more
    Lockheed Martin (04/10/24)
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  • Manual Wirebonder I

    Neotech (Chatsworth, CA)
    Summary: Operation of manual wire bond equipment in a clean-room... die attach assembly, sub attached assembly and wire bond and ribbon bonds on a ... + Written tests for ESD + wirebond and ribbon bond requirements. + Use tools such as fine tipped...bonder, K&S 4124, 4213, Hybond 522A - Manual Ball wire Bonder, Hybond 572A- Manual Ribbon Bonder, Unitek UB2-1-191-02,… more
    Neotech (05/02/24)
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  • Process Engineer

    Micross Components (Apopka, FL)
    …standards a plus. + Knowledge of Mil-STD-883 / Mil-STD-750 in test methods with related equipment ( wire bond , die attach, & furnace) a plus. + Knowledge or ... experience with Automatic assembly equipment for Wire bond , Die attach a plus + Knowledge in semiconductor manufacturing a plus. + Self-motivated with the… more
    Micross Components (05/07/24)
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  • Senior Package Design Engineer

    Micron Technology, Inc. (Boise, ID)
    …include substrate design databases, package stack-up, routing studies, substrate layout, wire bond diagrams, simulation, and other design documentation. ... but are not limited to the following:** + Support die padlog layout/optimization. + Support design of highly integrated...+ Advanced Memory Substrate Design for flip chip and wire bond interconnects + Design optimization for… more
    Micron Technology, Inc. (04/30/24)
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  • Assembler, Electro Mech

    Teledyne (Hawthorne, CA)
    …and Responsibilities** + Setup and operate automatic and/or manual bonding machines that bond gold and aluminum wire to integrated circuit dies to connect ... a variety of other related equipment, including high-powered microscopes, Dage wire pull and die shear equipment with speed and accuracy + Operate cleaning and… more
    Teledyne (05/07/24)
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  • U109 Solid State Technician - 3rd Shift

    Northrop Grumman (Linthicum, MD)
    …supports heat dissipation, and facilitates electrical connection to the outside world. + Wire Bond : Creating an electrical connection to the external ... frame and sent to tooling that cuts the mounted wafer into per-determined die size. + Die Sort : Picking pre selected discrete semiconductor devices from a diced… more
    Northrop Grumman (04/19/24)
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  • Assembly Operator

    Micross Components (Milpitas, CA)
    …tasks under microscope eight hours a day + Perform 2nd and 3rd optical visual inspection, die attach, wire bond , stud pull, wire dressing, wire ... for high reliability and state-of-the-are electronics, Micross' solutions range from bare die and wafer processing to advanced and custom packaging to component… more
    Micross Components (05/07/24)
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  • Laser Module Packaging Engineer (Boston…

    Lightmatter (Mountain View, CA)
    …(butt coupling), die to lens attach, and fiber attach processes, and wire bond . + Excellent verbal and written communication skills to effectively ... collaborate with cross-functional teams and present findings to stakeholders. + Exposure to quality and reliability requirements for optical components. Benefits + Comprehensive Health Care Plan (Medical, Dental & Vision) + 401k matching + Life Insurance… more
    Lightmatter (04/13/24)
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  • Mini-LED & Micro-LED Process Engineer

    Daktronics (Brookings, SD)
    …processes, evaluate materials, and test product designs. The labs consist of die bonders, micro-LED mass transfer printers, spin coaters, plasma etch, curing ... systems, bond tester, encapsulant machine, and analysis tools. This is...to perform the job functions. + Distinguish and identify wire colors. + Work with odors (solder/paint/solvent/manufacturing odors). +… more
    Daktronics (05/14/24)
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  • AssocOprtns Semi-Conductor Ld

    Honeywell (Richardson, TX)
    …Key Responsibilities Run multiple component assembly tools including laser scribe, solder flow, die attach (pick& place), wire bond , epoxy encapsulation & ... test Support the engineering team with process/tool trouble shotting and optimization tasks Understanding Dimensional Measurement Requirements Tool Qualification & Process Capability Must be able to do use a microscope to perform monitoring inspection of in… more
    Honeywell (05/02/24)
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  • Materials Engineer, Electronic Materials (Starlink…

    SpaceX (Bastrop, TX)
    …characterization techniques and equipment, including but not limited to: mechanical testing (ie, wire bond , die shear and peel testing), electrical testing ... (ie, split cylinder resonator) and optical inspection (ie, Scanning Electron Microscopy/Focused Ion Beam (SEM/FIB), Energy Dispersive Spectroscopy (EDS), Computed Tomography (CT), X-ray, thermal/IR images) + Broad understanding of failure modes in commercial… more
    SpaceX (04/27/24)
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  • Sr Electrical Engineer - Failure Analysis

    RTX Corporation (Andover, MA)
    …and understanding of electrical schematics, circuit analysis, digital processing, RF analysis, die level analysis, and the materials of electrical components (metal ... wire bonding, substrates, solder, adhesives, & encapsulants). The devices...testers, megohmmeters, laser millers, plasma etchers, chemical jet etchers, bond puller, etc. + Researching, investigating, and experimenting with… more
    RTX Corporation (04/04/24)
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