- General Motors (Flint, MI)
- **Job Description** Engineer , develop, integrate, and release new 40 ton, full molded casted stamping dies for 2000 ton presses to be delivered to Stamping Plants in ... assemblies, and dash panels. Plan, assure, control, and coordinate die quality and development process including die ...field, and five (5) years of experience as an Engineer , Leader, or related role. Must also have experience… more
- G-TECH Services, Inc. (Dearborn, MI)
- …required 4. 5+ Years of experience in tool related field ( tool construction, assembly integration , manufacturing feasibility, processing, cost estimating) a. ... Early On-Boarding EOB executed on Components identified as requiring early feasibility by tool shops 2. Effective Sourcing Approach insured by validating tool … more
- Textron (Coventry, RI)
- … tool , additive part fabrication and assembly manufacturing processes, equipment, tool integration , and product verification\. * Electrical and Mechanical ... Systems - design, integration and installation manufacturing processes, tool integration , equipment, and product verification\. * Manufacturing Execution… more
- Ford Motor Company (Irvine, CA)
- …+ Excellent understanding of manufacturing processes, fabrication methods, materials, and tool design ( die casting, injection moulding, sheet metal forming, ... electric and connected vehicles and services. The Senior Mechanical Engineer will be responsible primarily for HV power distribution...team in OBC, DC-DC converter and BMS development and integration into battery pack. **What you'll be able to… more
- Micron Technology, Inc. (Folsom, CA)
- …uses information to enrich life. We are looking for a HBM Digital Design Engineer . Are you passionate about designing circuits for the next generation of memory that ... responsible for designing and analyzing digital circuits for DRAM and interface die . This includes simulating, optimizing, and floor planning circuits. In this… more
- Amazon (Austin, TX)
- …on our world-class server infrastructure; we're handling massive scale and rapid integration of emergent technologies. As a member of the Cloud-Scale Machine ... giving feedback on Electromigration, IR drop, and Power Integrity analysis at the die , package, and PCB levels Providing inputs for thermal analysis and reviewing… more
- The Boeing Company (Huntington Beach, CA)
- …your future with us. The Boeing company is seeking a **Microelectronics Packaging Engineer (Mid-Level, Lead or Senior)** to join our team in **Huntington Beach, ... experience in the field of microelectronics packaging including MCM, heterogeneous integration , 3D chip stacking, etc + Experience with complex packaging… more
- Skyworks (Andover, MA)
- RFIC PA / Module Design Engineer Apply now " Date:Apr 10, 2024 Location: Andover, MA, US Company: Skyworks If you are looking for a challenging and exciting career ... Center. The candidate will contribute to the concept, design, integration , and delivery of complex multichip RFIC-based wireless module...+ Demonstrated expertise with at least one major EM tool for full IC + module level simulation. +… more