- Henkel (Irvine, CA)
- … advanced packaging environment. + Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package + Expertise in ... Principal Application Engineer _ Semiconductor Advanced Package **_About_**... who provides technical engineering support for Henkel's Advanced Packaging Material products and responsible for developing in depth… more
- Micron Technology, Inc. (Boise, ID)
- …world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront ... of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated… more
- Micron Technology, Inc. (Boise, ID)
- …Electrical Engineering, or related field + 5+ years of experience in Advanced Packaging Technology metrology or RDA development for semiconductor products + ... in the industry. As a Principal RDA and Metrology Engineer in APTD, you will be primarily responsible for...**Preferred Experience:** + 8+ years working directly with Advanced Packaging metrology or RDA development in the semiconductor… more
- Micron Technology, Inc. (Boise, ID)
- …who is optimistic and responsible. **Job Responsibilities:** + Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …Process Control (SPC), Defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …Process Control (SPC), defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …Integration teams, supporting technology development across Planar DRAM, Advanced DRAM, and Advanced Packaging TD. As a Process Quality Engineer , you will be ... we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM...half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform… more
- Teradyne (North Reading, MA)
- …Overview The Innovation Lab is an advanced R&D team that is part of the Semiconductor Test Division at Teradyne. We have a dual charter to technically support the ... division and company: + Create long-term differentiated solutions for our core Semiconductor Test business by exploring new technologies and architectures to be… more
- Micron Technology, Inc. (Boise, ID)
- …Overview:** As a GQ Package Design/Development Quality Assurance (Pkg DDQA) Principal Engineer at Micron Technology Inc., you will be responsible for the quality ... Engineering, Physics, or related field. + 7+ years of experience in semiconductor package design, manufacturing, or Quality & Reliability (Q&R). + Experience with… more
- Micron Technology, Inc. (Boise, ID)
- …experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging . + Position level will be determined based on education and experience. ... to learn, communicate and advance faster than ever. **Workforce Development Engineer ** **Technology & Products Group (TPG)** **Location: Boise, ID or Richardson,… more
- Teradyne (North Reading, MA)
- …Overview The Innovation Lab is an advanced R&D team that is part of the Semiconductor Test Division at Teradyne. We have a dual charter to technically support the ... company: + Create long-term differentiated solutions for our core Semiconductor Test business by exploring new technologies and architectures...customer base. We are seeking a Senior Microwave R&D Engineer to join the Teradyne Innovation Lab - the… more
- Renesas (San Jose, CA)
- Staff Application Engineer Job Description We are seeking an experienced and highly motivated **Staff Application Engineer ** to join our team focusing on ... Cross-functional Teams** : Work closely with design, product, test, packaging and other teams to ensure DDR5 solutions meet...our many benefits and resources Renesas is an embedded semiconductor solution provider driven by its Purpose ' **To… more
- Micron Technology, Inc. (Boise, ID)
- …communicate and advance faster than ever. **Principal** **Signal Integrity** ** Engineer ** **- Interface Pathfinding** Micron's Interface Pathfinding team serves as ... opportunities for, and drive, performance scaling through innovative circuit, signaling, packaging and interconnect solutions with a 3-5 year outlook, and to… more
- JE Dunn Construction Company (Council Bluffs, IA)
- Field Engineer , Mission Critical Location: Council Bluffs, IA, US **Best People + Right Culture. These are the driving forces behind JE Dunn's success.** **By hiring ... to serve innovative clients on large Industrial & Manufacturing, Data Center, and Semiconductor projects. As part of the Advanced Facilities team, you'll work on… more
- Micron Technology, Inc. (Boise, ID)
- …areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)! **Responsibilities:** + Development of future ... improvement in performance scaling, signaling, and sophisticated packaging + Leverage modeling and simulation methodology to improve accuracy to signal integrity… more
- Micron Technology, Inc. (Richardson, TX)
- …than ever. Micron is seeking a highly motivated and experienced ASIC Design Engineer to define and drive the architecture of next-generation ASICs prototypes. These ... memory access and management. + Collaborate with firmware, system, and packaging engineering teams to ensure end-to-end system optimization. + Drive performance,… more
- Micron Technology, Inc. (Boise, ID)
- …to learn, communicate and advance faster than ever. As a CMBU Systems Architecture Engineer at Micron Technology, you will have the opportunity to establish a deep ... memory hierarchy, and compute system architectures. + Exposure to packaging technologies such as TSV, stacked packaging ,...equity, or benefits. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing… more
- Google (Mountain View, CA)
- …technical field, or equivalent practical experience. + 8 years of experience as a Semiconductor Process, Yield, or Packaging Engineer . + Experience leading ... Computer Engineering, or Material Engineering. + 20 years of experience in Semiconductor Manufacturing (including wafer processing or packaging processing) and… more
- Meta (Sunnyvale, CA)
- …III-V material physics, especially LEDs and microLEDs 21. Expertise in advanced semiconductor packaging technologies such as COWOS, wafer reconstitution, InFO, ... We are looking for a highly skilled and driven Semiconductor Display Product Test Engineer to join...integration process. You will work cross-functionally with design, systems, packaging , and other XFN teams to ensure robust, scalable,… more
- Henkel (Irvine, CA)
- … materials. Your work directly impacts performance and reliability of next-generation semiconductor packaging technologies. + Serve as the technical lead for ... Principal Application Engineer - Semiconductor Advanced Package **_About_**...Henkel's advanced semiconductor packaging materials. + Work directly with… more
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