• Henkel (Irvine, CA)
    …product lines and/or product classes by novel approaches to application process development , troubleshooting, and material characterization. **What makes you ... packaging environment. + Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D...package + Expertise in wafer level encapsulation and molding process in semiconductor package + Have strong… more
    DirectEmployers Association (11/13/25)
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  • Micron Technology, Inc. (Boise, ID)
    …Physics, or other related field + 0-6 years of direct experience working as a process development engineer in an R&D environment + Knowledge of Advanced Package ... the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    DirectEmployers Association (12/09/25)
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  • SanDisk (Milpitas, CA)
    …within a technical organization. + Deep understanding of semiconductor packaging processes, supply chain dynamics, and product development lifecycles. ... of Staff to the Vice President of Package Technology Development and Integration is a strategic and operational leader...Engineering organization. This role requires a strong background in semiconductor packaging technologies, as well as the… more
    DirectEmployers Association (10/23/25)
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  • Micron Technology, Inc. (Boise, ID)
    …5+ years of experience in Advanced Packaging Technology metrology or RDA development for semiconductor products + Strong knowledge of RDA tooling capability, ... out sensitivity and gauge evaluation/optimization to implement changes at process step + Lead and participate in yield improvement...directly with Advanced Packaging metrology or RDA development in the semiconductor industry + Data… more
    DirectEmployers Association (12/06/25)
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  • Micron Technology, Inc. (Boise, ID)
    …Virtual Metrology, AI, process control, yield improvement, quality control, semiconductor process engineering, image analytics, or related semiconductor ... analyzing and extracting valuable insights from large datasets related to semiconductor manufacturing, process optimization, and quality control. You'll… more
    DirectEmployers Association (11/06/25)
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  • Micron Technology, Inc. (Boise, ID)
    …your work will be to address all Thermal aspects of 2.5D and 3D advanced packaging development that are related to design, material and process interactions. ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at… more
    DirectEmployers Association (10/07/25)
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  • Micron Technology, Inc. (Boise, ID)
    Process Control (SPC), Defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron... process capability + Collaborating with Equipment teams, Process Development and Process Integration… more
    DirectEmployers Association (12/06/25)
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  • Micron Technology, Inc. (Boise, ID)
    …teams, supporting technology development across Planar DRAM, Advanced DRAM, and Advanced Packaging TD. As a Process Quality Engineer, you will be recognized ... and contribute to the growth and innovation of the semiconductor industry. The Process Quality Engineering (PQE)...facilitates new material integration (NMI) in close collaboration with Process Development and Process Integration… more
    DirectEmployers Association (11/05/25)
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  • Micron Technology, Inc. (Boise, ID)
    Process Control (SPC), defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at… more
    DirectEmployers Association (12/11/25)
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  • Micron Technology, Inc. (Boise, ID)
    …for advanced memory solutions. Our team collaborates with Technology Development , Engineering, and customer-facing groups to mitigate risks, drive innovation, ... analysis, and continuous improvement. **Position Overview:** As a GQ Package Design/ Development Quality Assurance (Pkg DDQA) Principal Engineer at Micron Technology… more
    DirectEmployers Association (12/18/25)
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  • Micron Technology, Inc. (Boise, ID)
    …Advanced Packaging functions. **What You'll Do** As a Workforce Development Engineer, you will: + Collaborate with engineering, manufacturing, and leadership to ... experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging . + Position level will be determined based on education and experience.… more
    DirectEmployers Association (10/17/25)
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  • Micron Technology, Inc. (Richardson, TX)
    …Support multi-functional initiatives involving Build Engineering, Product Engineering, and Process Development . + Contribute to architectural decisions impacting ... high-performance computing and 2.5D/3D packaging . + Communicate technical findings and compose insights for...Previous internship or project experience in memory architecture or semiconductor development . As a world leader in… more
    DirectEmployers Association (10/10/25)
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  • Teradyne (North Reading, MA)
    …of modern digital semiconductor development - design, DFT, fabrication process , packaging , and device testing + Basic understanding of datacenter and ... integrate and excel across segments, positioning Teradyne as the go-to provider in semiconductor testing. By partnering with a diverse range of customers - from… more
    DirectEmployers Association (10/30/25)
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  • Micron Technology, Inc. (Boise, ID)
    …implementation of new product concepts. Working closely with Product and Business Development Managers you will ensure that each technical decision is aligned with ... memory hierarchy, and compute system architectures. + Exposure to packaging technologies such as TSV, stacked packaging ,...salary range for your preferred location during the hiring process . Please note that the compensation details listed in… more
    DirectEmployers Association (11/21/25)
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  • Micron Technology, Inc. (Boise, ID)
    …subject areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)! **Responsibilities:** + Development of ... products like HBM, GDDR, LPDRAM, DDR5/DDR6, PCIeGen6 and sophisticated signaling development . We handle the interconnect and signaling exploration and development more
    DirectEmployers Association (11/20/25)
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  • Micron Technology, Inc. (Boise, ID)
    …strategy and the engineering teams through forward-looking investigation and development of energy-efficient bandwidth solutions in support of sustained technology ... opportunities for, and drive, performance scaling through innovative circuit, signaling, packaging and interconnect solutions with a 3-5 year outlook, and to… more
    DirectEmployers Association (12/10/25)
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  • Advanced Energy (Eden Prairie, MN)
    …for manufacturability, quality and reliability + Ensure that product design / development process is compliant with internal standards / procedures + ... complex applications for a wide range of industries including semiconductor equipment, industrial, manufacturing, telecommunications, data center computing and… more
    DirectEmployers Association (12/09/25)
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  • JE Dunn Construction Company (Houston, TX)
    …alternate delivery methods. This position requires proactive leadership of the design process from initial business development phase through project completion. ... to serve innovative clients on large Industrial & Manufacturing, Data Center, and Semiconductor projects. As part of the Advanced Facilities team, you'll work on… more
    DirectEmployers Association (11/04/25)
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  • Packaging Technical Leader

    Cisco (San Jose, CA)
    …of progressive industry experience in Semiconductor Packaging or Photonic packaging or Assembly process development or integration, with demonstrable ... flip-chip, heterogenous integration). Oversee various aspects such as package assembly, process development , reliability qualification, materials and testing. *… more
    Cisco (11/12/25)
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  • Staff Semiconductor Process Engineer

    Lockheed Martin (Goleta, CA)
    …accredited college in Engineering, Physics, or related discipline\. * Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with ... include, but are not limited to: + Work with development and process integration engineers to adapt...attach/bonding, polishing, substrate removal, or Anti\-Reflection \(AR\) coating or semiconductor packaging techniques\. * Must be a… more
    Lockheed Martin (12/11/25)
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