- Henkel (Irvine, CA)
- … advanced packaging environment. + Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package + Expertise in ... Principal Application Engineer _ Semiconductor Advanced Package **_About_**...wafer level encapsulation and molding process in semiconductor package + Have strong… more
- Micron Technology, Inc. (Boise, ID)
- …nodes to maintain Micron's leadership in the industry. As a Senior Wet Process Engineer , you will be primarily responsible for developing and optimizing ... learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is...+ 0-6 years of direct experience working as a process development engineer in an R&D environment… more
- Micron Technology, Inc. (Boise, ID)
- …Electrical Engineering, or related field + 5+ years of experience in Advanced Packaging Technology metrology or RDA development for semiconductor products + ... in the industry. As a Principal RDA and Metrology Engineer in APTD, you will be primarily responsible for...**Preferred Experience:** + 8+ years working directly with Advanced Packaging metrology or RDA development in the semiconductor… more
- Micron Technology, Inc. (Boise, ID)
- …Process Control (SPC), Defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is...the future of technology! **Position Overview:** As a Senior Process Engineer in the APTD team, you… more
- Micron Technology, Inc. (Boise, ID)
- …who is optimistic and responsible. **Job Responsibilities:** + Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …Process Control (SPC), defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... technology nodes, maintaining Micron's leadership in the industry. **Position Overview:** As a Process Engineer on the APTD Bonding team, you will be responsible… more
- Micron Technology, Inc. (Boise, ID)
- …development across Planar DRAM, Advanced DRAM, and Advanced Packaging TD. As a Process Quality Engineer , you will be recognized as a domain expert in Fab ... team and contribute to the growth and innovation of the semiconductor industry. The Process Quality Engineering (PQE) team operates at the critical interface… more
- Micron Technology, Inc. (Boise, ID)
- …Overview:** As a GQ Package Design/Development Quality Assurance (Pkg DDQA) Principal Engineer at Micron Technology Inc., you will be responsible for the quality ... Engineering, Physics, or related field. + 7+ years of experience in semiconductor package design, manufacturing, or Quality & Reliability (Q&R). + Experience with… more
- Micron Technology, Inc. (Boise, ID)
- …experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging . + Position level will be determined based on education and experience. ... to learn, communicate and advance faster than ever. **Workforce Development Engineer ** **Technology & Products Group (TPG)** **Location: Boise, ID or Richardson,… more
- Micron Technology, Inc. (Boise, ID)
- …communicate and advance faster than ever. **Principal** **Signal Integrity** ** Engineer ** **- Interface Pathfinding** Micron's Interface Pathfinding team serves as ... opportunities for, and drive, performance scaling through innovative circuit, signaling, packaging and interconnect solutions with a 3-5 year outlook, and to… more
- JE Dunn Construction Company (Council Bluffs, IA)
- Field Engineer , Mission Critical Location: Council Bluffs, IA, US **Best People + Right Culture. These are the driving forces behind JE Dunn's success.** **By hiring ... to serve innovative clients on large Industrial & Manufacturing, Data Center, and Semiconductor projects. As part of the Advanced Facilities team, you'll work on… more
- Micron Technology, Inc. (Boise, ID)
- …areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)! **Responsibilities:** + Development of future ... improvement in performance scaling, signaling, and sophisticated packaging + Leverage modeling and simulation methodology to improve accuracy to signal integrity… more
- Micron Technology, Inc. (Richardson, TX)
- …than ever. Micron is seeking a highly motivated and experienced ASIC Design Engineer to define and drive the architecture of next-generation ASICs prototypes. These ... memory access and management. + Collaborate with firmware, system, and packaging engineering teams to ensure end-to-end system optimization. + Drive performance,… more
- Micron Technology, Inc. (Boise, ID)
- …to learn, communicate and advance faster than ever. As a CMBU Systems Architecture Engineer at Micron Technology, you will have the opportunity to establish a deep ... memory hierarchy, and compute system architectures. + Exposure to packaging technologies such as TSV, stacked packaging ,...salary range for your preferred location during the hiring process . Please note that the compensation details listed in… more
- Google (Mountain View, CA)
- …equivalent practical experience. + 8 years of experience as a Semiconductor Process , Yield, or Packaging Engineer . + Experience leading cross-functional ... or Material Engineering. + 20 years of experience in Semiconductor Manufacturing (including wafer processing or packaging ...salary range for your preferred location during the hiring process . Please note that the compensation details listed in… more
- Lockheed Martin (Goleta, CA)
- …If you're a motivated and experienced engineer with a passion for process engineering and a strong background in semiconductor manufacturing, we encourage ... **Description:** You will be a Focal Plane Array Process Engineer with our Infrared Sensors...in Engineering, Physics, or related discipline\. * Experience in semiconductor packaging or FPA manufacturing in a… more
- Meta (Sunnyvale, CA)
- …experience in semiconductor test engineering, product engineering, REL / QUAL, process engineering, or advanced integration and packaging (eg CoWoS) 14. ... We are looking for a highly skilled and driven Semiconductor Display Product Test Engineer to join...physics, especially LEDs and microLEDs 21. Expertise in advanced semiconductor packaging technologies such as COWOS, wafer… more
- Henkel (Irvine, CA)
- … materials. Your work directly impacts performance and reliability of next-generation semiconductor packaging technologies. + Serve as the technical lead for ... Principal Application Engineer - Semiconductor Advanced Package **_About_**...Henkel's advanced semiconductor packaging materials. + Work directly with… more
- Northrop Grumman (Apopka, FL)
- …to join our team as a_ **_Principal Microelectronics Semiconductor Metals Process Engineer_** _for our Advanced Packaging Technology facility in_ **_Apopka, ... FL_** _._ _The_ **_Principal Microelectronic Semiconductor Metals Process Engineer_** _will provide senior fabrication support and technical direction for a wide… more
- Northrop Grumman (Elkridge, MD)
- …history, they're making history. Northrop Grumman is seeking a Sr Principal Manufacturing Engineer to be located at our Mission Systems Sector in **Elkridge, MD** . ... fast paced environment where he/she will interact with multiple disciplines. ** Process Development** + Developing new and maintaining, or improving, existing… more
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